Ephraim Suhir is on the faculty of Portland State University, Portland, OR, USA, Technical University, Vienna, Austria, and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”).
Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. This year he received the 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and Int. Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement Award for making an exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.
Editor: ASME Journal of Electronic Packaging (1994-2002); Springer’s book series on physics, mechanics and reliability of materials in micro- and opto-electronics (2006-); Silicon Valley Engineering Council (SVEC) Journal (2010)
Co-founder (1985) and Senior Associate Editor, ASME Journal of Electronic Packaging (1989-1994)
Contributing Editor: Chip Scale Reviews (2013-);
Distinguished Lecturer, IEEE Electronic Packaging Society (1995-)
Member, IEEE EDS Device Reliability Physics Committee (2019-); ASME AMD/MD Technical Committee on Constitutive Equations (2017-);IEEE TAB New Technology Directions Committee (1999-2007); ASME General Awards Committee (2007-2015); IEEE CPMTS Fellowship Evaluation Committee (2001-) and Award Committee (2002-2017); IEEE VTS Fellowship Committee (2011-2015); ASME Boards on Professional Developments, and on Research and Technology (2000-2004); Advisory Committee, ASME Press, Monograph/Proceedings Series on "Materials, Molding, and Computation" (1992-2002); Society of Automotive Engineers (SAE), Committees on Fiber Optics and Avionic Engineering (2004-); Board of Governors, IEEE EPS (1996-2012); Team of experts serving AT&T, Lucent Technologies, and Bell Labs R&D communities in Applied Mechanics, Applied Physics, Mechanical Behavior of Materials, Manufacturing Engineering, Mechanical and Reliability Engineering, and Applied Probability (1990-2001)
Chairman, IEEE Group on Portable Information Devices; IEEE TAB New Technologies Direction Committee (2005-2007);IEEE VTS TC on Portable Devices (2007-2009); Honors and Awards Committee, ASME Electrical and Electronic Packaging Division and K-16 Committee (Heat Transfer in Microelectronics) of the Heat Transfer Division (1991-2000); New Technology Directions Committee, IEEE CPMT Society (1998-2002)
General Chair or Co-Chair: IEEE CPMT ASTR Conferences, San-Francisco, CA, September 2011; College Park, MD, October 2008;IEEE Conference on Portable Information Devices, Portable’09, Anchorage, AK, September 2009;
IEEE/ASME/IMAPS Workshops on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, 1998, 1999, London, 2000; International Conference on Electronic and Photonic Packaging (Interpack-97), Hawaii, 1997; ASME Winter Annual Meetings, Division of Electrical and Electronic Packaging, Symposia on Structural Analysis in Electronic and Fiber-Optic Systems (1987-2001);IEEE Conference on Portable Devices and Polymeric Materials for Electronic and Photonic Applications, Garmisch-Partenkirchen, Germany, August 2008; IEEE Conference on Portable Information Devices, Portable’07, Orlando, Florida, March 2007; Accelerated Stress Testing and Reliability (ASTR) Workshop, ASTR’07, College Park, MD, October 2007; Track on Thermal Phenomena in Electronic Systems, IEEE Vehicular Power and Propulsion Conference (VPPC), Dearborn, MI, USA, Sept. 2009; Chicago, IL, USA, Sept. 2011
Symposium Organizer/Co-Organizer, MRS Annual Meetings, Symposium on Mechanical Behavior of Microelectronic Materials and Structures (Boston,1990); Symposium on Reliability of Photonics Materials and Structures (San-Francisco, 1998); Symposium on Optical Interconnects (San Francisco, 2012); Symposium on Constitutive Modeling of the Mechanical Behavior and Performance of Electronic, Photonic, MEMS, and NEMS Materials, Assemblies, Packages, Modules, and Systems, 2018, Nov.9-15, Pittsburgh, PA,USA
Organizing/Scientific/Steering Committee Member, International Conference on Materials, Processing and Product Engineering, MPPE, Austria (2015-);IEEE Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, POLYTRONIK’ 2001, Potsdam, Germany; 2002, Budapest, Hungary; 2003, Monreaux, France; 2004, Portland, OR, USA; 2005, Wroclaw, Poland;THERMINIC, European workshop on thermal phenomena in micro- and opto-electronic (1988-2014); IEEE Annual Electronic Components and Technology Conferences, Electronic Packaging, Interconnection, and Reliability Committees (1988-2016); International Conferences on Electronic Packaging (San Jose, CA, 1990, Binghamton, NY, 1992, Hawaii, 1995, 1999)
Session Organizer and Co-Chair, IEEE Aerospace Conference, Big Sky, Montana, 2012-2016