BROCHURE
Ephram Suhir is a Adjunct Professor,James Cook University,USA

Ephram Suhir

Adjunct Professor

Organizing Committee

USA

James Cook University

BIOGRAPHY

Ephraim Suhir is on the faculty of Portland State University, Portland, OR, USA, Technical University, Vienna, Austria, and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA,  is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society  (IMAPS);  Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”).

        Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. This year he received the 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and Int. Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement Award for making an exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.

 

PUBLICATIONS

400+ publications include patents, books, book chapters, papers in archival journals and in edited conference proceedings; articles in trade magazines; numerous invited, keynote and webinar presentations to different audiences and at different conferences, symposia and technical meetings and workshops worldwide, as well as numerous short courses and tutorials.

Patents

  1. C. Dangelo, E. Suhir,  S. Dey, B. Wacker, Y. Xu, A. Boren, D. Olsen, Y. Zhang, P. Schwartz; B. Padmakumar,  “Carbon Nanotube-Based Structures and Methods for Removing Heat From Solid-State Devices”, US Patent #8,080,871, 2011
  2. E. Suhir, Y. Xu, Y. Zhang,  “ Method and Apparatus for Evaluation and Improvement of Mechanical and Thermal Properties of CNT/CNF Arrays”, US Patent # 8,048,688, 2011
  3. E. Suhir, R. L. Kroeze, P. Schwartz, K. S. Ravindhran, “Composite Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices”, US Patent #8,039,961, 2011
  4. E. Suhir, “Apparatus for Attaching a Cooling Structure to an Integrated Circuit”, US Patent #7,477,527, 2009
  5. D. Ingman, V. Ogenko, E. Suhir, A. Glista, “Moisture Resistant Nano-Particle Material and Its Applications”, US Patent #7,321,714B2, 2008
  6. E. Suhir, “Apparatus and Test Device for the Application and Measurement of Prescribed, Predicted and Controlled Contact Pressure on Wires”, US Patent #7,279,916, 2007
  7. D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Overclad”, US Patent, #7,162,138 B2, 2007
  8. D. Ingman and E.Suhir, “Optical Fiber with Nano-Particle Cladding”, US Patent, #7,162,137 B2, 2007
  9. E. Suhir, “Coated Optical Glass Fiber”, US Patent #6,647,195, 2003.
  10. E. Suhir, “Optical Fiber Interconnects Having Offset Ends with Reduced Tensile Strength and Fabrication Method”, US Patent #6,606,434, 2003
  11. E. Suhir, “Bi-Material Assembly Adhesively Bonded at the Ends and Fabrication Method”, US Patent #6,460, 753, 2002
  12. E. Suhir, “Strain Free Planar Optical Waveguides”, US Patent #6,389,209, 2002
  13. E.Suhir, “Apparatus and Method for Thermostatic Compensation of Temperature Sensitive Devices”, US Patent #6,337,932, 2002
  14. E.Suhir, “Method of Improving the Performance of Optical Fiber, which is Interconnected Between Two Misaligned Supports”, U.S. Patent #6,314,218, 2001
  15. E. Suhir, “Interconnected Optical Devices Having Enhanced Reliability”, U.S. Patent #6,327,411, 2001
  16. E. Suhir, “Arrangement for Reducing Bending Stress in an Electronics Package”, U.S. Patent #6,180,241, 2001
  17. E. Suhir, “Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly,” US Patent #6,239,382, 2001.
  18. E. Suhir, “Method for Determining and Optimizing the Curvature of a Glass Fiber for Reducing Fiber Stress”, US Patent #6,016,377, 2000
  19. E. Suhir,  "Electronic Assembly Having Improved Resistance to Delamination", U.S. Patent #6,028,772, 2000
  20. E. Suhir, “Method and Apparatus for Proof-testing Optical Fibers”, US Patent #6,119,527, 1998
  21. E. Suhir, “Data Carriers Having an Integrated Circuit Unit”, US Patent #5,703,350, 1997
  22. E. Suhir and J. Weld, “Electronic Package with Reduced Bending Stress”, US Patent #5,627,407, 1997.
  23. E. Suhir et al, “Pattern For Tube Bending”, Certificate of Authorship #487692, Official Bulletin of Inventions and Discoveries, State Committee for Inventions and Discoveries, No. 38, Moscow, Russia, 1975.

Books

Monographs

  1. E.Suhir, “Could Inelastic Strain in Solder Material Be Avoided?”, agreement with CRC Press, 2018
  2. E. Suhir, “Mechanical Behavior of Electronic Materials and Systems”, agreement with Springer, Sept. 8, 2017 
  3. E. Suhir, “Human-in-the-Loop: Probabilistic Modeling of an Aerospace Mission Outcome”, CRC Press, 2018
  4. E. Suhir, “Applied Probability for Engineers and Scientists”, McGraw Hill, New York, 1997.
  5. E. Suhir, “Structural Analysis in Microelectronic and Fiber Optic Systems”, vol.1, Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis”, Van Nostrand Reinhold, New York, 1991.
  6. E. Suhir, P. McSharry, “Soviet Naval Architecture: Theory and Applications of Hydrodynamics (Trans from Russian)”, American Bureau of Shipping, 1986
  7. E. Suhir, Y. Raskin, A. Tunik, “Russian Strength Standards for Commercial Ships”, American Bureau of Shipping, 1982

Edited and co-edited books

  1. E. Suhir, D. Steinberg, T. Yi, eds., “Dynamic Response of Electronic and Photonic Systems to Shocks and Vibrations”, John Wiley, 2011
  2. X. Fan, E. Suhir, “Moisture Sensitive Plastic Packages of IC Devices”, Springer, 2010
  3. E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
  4. R. G. Driessen, J. G. Baets, J. G. McInerney, and E. Suhir, eds.“Laser Diodes, Optoelectronic Devices, and Heterogeneous Integration”, SPIE,  2003
  5. E. Suhir, M. Fukuda, C. R. Kurkjian, eds., “Reliability of Photonic Materials and Structures”, Materials Research Society Symposia Proceedings, vol. 531, 1998.
  6. E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997
  7. E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1996
  8. E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1995
  9. M. Schen, H. Abe, and E. Suhir, eds. “Thermal and Mechanical Behavior and Modeling”, ASME, AMD-Vol,1994
  10. E. Suhir, R.C. Cammarata, D.D.L. Chung, M.Jono, eds. “Mechanical Behavior of Materials and Structures in    Microelectronics”, Materials Research Society Symposia Proceedings, vol.226, 1991.

Book chapters

  1. E.Suhir, “Probabilistic Reliability-Physics Models in Aerospace Human-in-the-Loop (HITL) Problems”, submitted

42.E.Suhir, “Mechanical Behavior of Optical Fibers and Interconnects: Application of Analytical Mechanics”, Encyclopedia of Continuum Mechanics, H.Altenbach, ed., 2019, in print

43.E.Suhir, “Design for Reliability of Electronic Materials and Systems”, Encyclopedia of Continuum Mechanics, H.Altenbach, ed., 2019, in print

44.E.Suhir, “Application of Analytical Modeling in the Design for Reliability of Electronic Packages and Systems”, Springer Encyclopedia of Continuum Mechanics, H.Altenbach and A.Oechsner, eds., published on line, 2019

  1. E. Suhir, “Mental Workload (MWL) vs. Human Capacity Factor (HCF): A  Way to Quantify Human Performance”:  in Gregory and Inna Bedny, eds., CRC Press, “Applied and Systemic-Structural Activity Theory”, 2019, in print
  2. E. Suhir, “Predicted Thermal and Lattice-Mismatch Stresses”, in T. Nishinaga and T.F.Kuech, eds., “Handbook of Crystal Growth”, 2e, vol.3, , Elsevier, 2015 
  3. E. Suhir, "Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen", Encyclopedia of Thermal Stresses, R. Hetnarski, ed., Springer, 2013
  4. E. Suhir, "Thermal Stress in a Multi-Leg Thermoelectric Module (TEM) Design", Ibid.
  5. E. Suhir, "Thermal Stress in a Tri-Materilal Assembly with Application to Silicon-Based Photovoltaic Module (PVM)", Ibid.
  6. E. Suhir, "Thermo-elastic Stability of an Embedded Nano-Fiber", Ibid.
  7. E. Suhir, “Linear Response to Shocks and Vibrations”, in E. Suhir, D. Steinberg and T. Yu, “Structural Dynamics of Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011
  8. E. Suhir, “Linear and Nonlinear Vibrations Caused by Periodic Impulses”. Structural Dynamics of Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011
  9. E. Suhir, “Random Vibrations of Structural Elements in Electronic and Photonic Systems”, Structural Dynamics of Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011
  10. C.Y.Zhou, T.X.Yu, S.W.Ricky Lee and E.Suhir, “Shock Test Methods and Test Standards for Portable Electronic Devices”, Structural Dynamics of Electronic and Photonic Systems”, John Wiley, Hoboken, NJ., 2011
  11. E. Suhir, “Shock Protection of Portable Electronic Devices Using a “Cushion” of an Array of Wires (AOW)”, John Wiley, Hoboken, NJ., 2011
  12. M. Vujosevic and E.Suhir, “Dynamic Response of PCB Structures to Shock Loading in Reliability Tests”, John Wiley, Hoboken, NJ., 2011
  13. E. Suhir, “Linear Response of a Single-Degree-of-Freedom System to an Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions?”, John Wiley, Hoboken, NJ., 2011
  14. E. Suhir and L. Arruda, “Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse”? John Wiley, Hoboken, NJ., 2011
  15. E. Suhir, “”Stretchable” Electronics: Predicted Thermo-Mechanical Stresses in the Die”,  Fraunhofer  Institute, Volume Dedicated to the 60-th Birthday of Prof. B. Michel, Berlin, Germany, 2009
  16. Y. Zhang, E. Suhir, C. Gu, “Physical Properties and Mechanical Behavior of  Carbon Nano-tubes (CNTs) and Carbon Nano-fibers  (CNFs) as Thermal Interface Materials (TIMs) for High Power Integrated Circuit (IC) Packages: Review and Extension, in C.P.Wong et al, eds, “Nano-Bio-Electronic, Photonic and MEMS Packaging”, Springer, 2009
  17. E. Suhir, “Fiber-Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
  18. E. Suhir, “Dynamic Response of Micro-Electronic Systems to Shocks and Vibrations: Review and Extension”, Ibid
  19. V. Birman and E. Suhir, “Effect of Material’s Nonlinearity on the Mechanical Response of Some Piezo-Electric and Photonic Systems”, “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
  20. E. Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
  21. E. Suhir, “How to Make a Device into a Product: Accelerated Life Testing It’s Role, Attributes, Challenges, Pirfalls, and Interaction with Qualification Testing”, “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
  22. E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, 2 volumes, Springer, 2008
  23. E. Suhir, “Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure”, in R. Tummala, M. Kosec, W. Kinzy Jones and D. Belavic, eds., “Electronic Packaging for High Reliability: Low Cost Electronics”, NATO ASI Series, 3. “High Technology”, vol.57, Kluwer Academic Publishers, 1999.
  24. E. Suhir, “Structural Analysis in Fiber Optics”, in J. Menon, ed., “Trends in Lightwave Technology”, Council of Scientific Information, India, 1995.
  25. E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit Devices”, in J. H. Lau, ed., Thermal Stress and Strain in Microelectronic Packaging”, Van Nostrand Reinhold, New York, 1993.
  26. E. Suhir and Y.C. Lee, “Thermal, Mechanical and Environmental Durability Design Methodologies in Electronic Packaging”, in “Handbook of Electronic Materials”, ASM International, 1990.
  27. E. Suhir, “Thermal Stress Failures in Microelectronic Components - Review and Extension”, in A. Bar-Cohen and A. D. Kraus, eds., “Advances in Thermal Modeling of Electronic Components and Systems”, Hemisphere, New York, 1988.

Archival (peer reviewed) journal papers

2019

  1. E.Suhir and I.Jatsiuk, “Bonded Tri-Material Specimen Subjected to Shear-Off Testing: Predicted Interfacial Stresses”, Journal of Aerospace Engineering and Mechanics (JAEM), in preparation
  2. E.Suhir and G.Paul, “Short-Note-Probabilistic Model Predicts Likeliood of Collision in Automated Driving”, IJHFMS, submitted
  3. E.Suhir, “Is Burn-in Always Needed in Electronics Manufacturing?”, Int. J. of Advanced Research in Electrical, Electronics and Instrumentation Engineering (IJAREEIE), submitted
  4. E.Suhir, “Interfacial Shearing Stresses and Warpage of Flip-Chip Packages: Application of Analytical Thermal Stress Modeling”, Scholar Journal of Applied Sciences and Research (SJASR), submitted
  5. E.Suhir and Z.Stamencovic, “Using Yield to Predict Long-Term Reliability of Integrated Circuit (IC) Devices: Application of Boltzmann-Arrhenius-Zhurkov (BAZ) Model”, Solid-State Electronics, submitted
  6. E.Suhir, “For How Long Should Burn-in Testing Last?”,  Journal of Electrical & Electronic Systems (JEES), accepted
  7. E.Suhir, “Making a Viable Medical Electron Device Package into a Reliable Product”, IMAPS Advancing Microelectronics, in print
  8. A.Ponomarev and E. Suhir, “Predicted Useful Lifetime of Aerospace Electronics Experiencing Ionizing Radiation: Application of BAZ Model”, Journal of Aerospace Engineering and Mechanics (JAEM), v.3, issue 1, 2019
  9. E.Suhir, “Analytical Thermal Stress Modeling in Electronics and Photonics Engineering: Application of the Concept of Interfacial Compliance”, Journal of Thermal Stresses, special issue dedicated to 90-th birthday of Prof. Richard Hetnarski, published on line
  10. E. Suhir, “Assessment of the Required Human Capacity Factor (HCF) Using Flight Simulator as an Appropriate Accelerated Test Vehicle”, IJHFMS,v.7,No.1, 2019
  11. E.Suhir, “Adequate Trust, Human-Capacity-Factor, Probability-Distribution-Function of Human Non-Failure and its Entropy”, IJHFMS, v.7, No.1, 2019
  12. E.Suhir, “Failure-Oriented-Accelerated-Testing (FOAT), Boltzmann-Arrhenius-Zhurkov Equation (BAZ) and Their Application in Microelectronics and Photonics Reliability Engineering”, Int. J. of Aeronautical Sci. and Aerospace Research (IJASAR), 6(3), 2019, pp. 185-191
  13. E.Suhir, “Failure-Oriented-Accelerated-Testing and Its Possible Application in Ergonomics”, Ergonomics International Journal, vol.3, No. 2, April 2019
  14. E.Suhir, S.Yi, J.S.Hwang, R. Ghaffarian, “Elevated Stand-Off Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief”, IMAPS J. of Microelectronics and Electronic Packaging, vol. 16, No. 1, Jan. 2019, pp. 13-20.
  15. E.Suhir, “To Burn-In, or Not to Burn-in: That’s the Question”, Aerospace, vol.6, No.3,2019
  16. E. Suhir and R. Ghaffarian, “Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure”, Journal of Electronic Materials, vol.48, No.2, 2019

2018

  1. E. Suhir and R. Ghaffarian, “Predicted Effect of the Underfill Glass Transition Temperature on Thermal Stresses in a Flip-Chip or a Fine-Pitch BGA Design”, Journal of Electrical and Electronic Systems (JEES), vol.7(4), 2018
  2. E.Suhir, “Low-Cycle-Fatigue Failures of Solder Material in Electronics: Analytical Modeling Enables to Predict and Possibly Prevent Them-Review”, Journal of Aerospace Engineering and Mechanics (JAEM), 2(1), 2018
  3. E.Suhir and R. Ghaffarian, “Constitutive Equation for the Prediction of an Aerospace Electron Device Performance-Brief Review”, Aerospace, vol.5, No.74,  2018
  4. E. Suhir and R. Ghaffarian, “Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics Packages – Brief Review”, Aerospace, 5(3), 74, July 2018
  5. E. Suhir, “Aerospace Mission Outcome: Predictive Modeling”, editorial, Special Issue “Challenges in Reliability Analysis of Aerospace Electronics”, Aerospace, 5(2), May 22, 2018
  6. E.Suhir, “What Could and Should Be Done Differently: Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making an Aerospace Electronics Device into a Product”, Journal of Materials Science: Materials in Electronics, vol.29, No.4, 2018
  7. E,Suhir, Editorial, “Quantifying Human Factors: Towards Analytical Human-in-the-Loop”, Special Issue of the Int. J. of Human Factor Modeling and Simulation, v.6, No.2/3, 2018
  8. E.Suhir, “Analytical Thermal Stress Model for a Typical Flip-Chip Package Design”, Journal of Materials Science: Materials in Electronics, vol.29, No.4, 2018
  9. E. Suhir, “Solder Joints in Surface Mounted IC Assemblies: Relief in Stress and Warpage Owing to the Application of Elevated Stand-off Heights”. J of Modern Applied Physics,2(1), 2018, pp.4-9

2017

  1. E.Suhir, “Aerospace Electronics Reliability Prediction: Application of Two Advanced Probabilistic Techniques”, Zeitschrift fur Angewandte Mathematiks und Mechaniks (ZAMM), vol.1, No.16, 2017
  2. E. Suhir, “Flip-Chip Assembly: Is a Bi-Material Model Acceptable?”, Journal of Materials Science: Materials in Electronics, Vol. 28, No. 21, 2017.
  3. E.Suhir, “Analytical Modeling Enables Explanation of Paradoxical Behaviors of Electronic and Optical Materials and Assemblies”, Advances in Materials Research, vol.6, No.2, 2017
  4. E. Suhir, “Human-in-the-Loop: Application of the Double Exponential Probability Distribution Function Enables One to Quantify the Role of the Human Factor”, Int. J. of Human Factor Modeling and Simulation, v.5, No.4, 2017
  5. E. Suhir and R. Ghaffarian, “Predictive Modeling of the Dynamic Response of Electronic Systems to Impact Loading: Review”, ZAMM, 97, No. 6,  2017
  6. E. Suhir, and S. Yi, “Probabilistic Design for Reliability (PDfR) of Medical Electronic Devices (MEDs): When Reliability is Imperative, Ability to Quantify it is a Must”, Journal of SMT, v. 30, Issue 1, 2017
  7. E. Suhir, S. Yi and R. Ghaffarian, “How Many Peripheral Solder Joints in a Surface Mounted Design Experience Inelastic Strains?”, Journal of Electronic Materials, v.46, No.3, 2017
  8. E. Suhir, “Static Fatigue Lifetime of Optical Fibers Assessed Using Boltzmann-Arrhenius-Zhurkov (BAZ) Model”, Journal of Materials Science: Materials in Electronics, v.28, No.16, 2017
  9. E. Suhir, R.Ghaffarian, S.Yi, and J.Nicolics “Assessed Interfacial Strength and Elastic Moduli of the Bonding Material from  Shear-off Test Data”, Journal of Materials Science: Materials in Electronics, v.28, No.9, 2017
  10. E. Suhir and R. Ghaffarian, “Solder Material Experiencing Low Temperature Inelastic Thermal Stress and Random Vibration Loading: Predicted Remaining Useful Lifetime”, Journal of Materials Science: Materials in Electronics, vol.28, No.4, 2017
  11. E. Suhir and R. Ghaffarian, “Probabilistic Palmgren-Miner Rule with Application to Solder Materials Experiencing Elastic Deformations”, Journal of Materials Science: Materials in Electronics, vol.28, No.3, 2017
  12. E. Suhir, and R. Ghaffarian, “Reliability Physics Behind the QFN State of Stress”, Journal of Materials Science: Materials in Electronics, v.28, No.2, 2017

2016

  1. E. Suhir, R. Ghaffarian, “Column-Grid-Array (CGA) vs. Ball-Grid-Array (BGA): Board-Level Drop Test and the Expected Dynamic Stress in the Solder Material”, Journal of Materials Science: Materials in Electronics, vol.27, No.11, 2016
  2. E. Suhir, S. Yi, G. Khatibi, J. Nicolics, M. Lederer, “Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit Stresses”, Journal of Materials Science: Materials in Electronics, vol.27, No.9, 2016
  3. E. Suhir, R. Ghaffarian, “Board Level Drop Test: Exact Solution to the Problem of the Nonlinear Dynamic Response of a PCB to the Drop Impact”,  Journal of Materials Science: Materials in Electronics, vol.27, No.9, 2016
  4. E.  Suhir, “Analytical Modeling Occupies a Special Place in the Modeling Effort”, Short Comm., J.Phys.Math., 7(1), 2016
  5. E. Suhir, J. Morris, L. Wang, and S. Yi, “Could the Dynamic Strength of a Bonding Material in an Electronic Device Be Assessed from Static Shear-Off Test Data?”, Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016
  6. E. Suhir, and J.Nicolics, “Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS’): Predicted Thermal Stresses”, Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016
  7. E. Suhir, “Bi-Material Assembly Subjected to Thermal Stress: Propensity to Delamination Assessed Using Interfacial Compliance Model”,  Journal of Materials Science: Materials in Electronics, vol.27, No.7, 2016
  8. E. Suhir, “Expected Stress Relief in a Bi-Material Inhomogeneously Bonded Assembly with a Low-Modulus-and/or-Low-Fabrication-Temperature Bonding Material at the Ends”, Journal of Materials Science: Materials in Electronics, vol.27, No.6, 2016
  9. E. Suhir, R. Ghaffarian, "Predicted Stresses in a Ball-Grid-Array (BGA)/Column-Grid-Array (CGA) Assembly with Epoxy Adhesive at Its Ends", Journal of Materials Science: Materials in Electronics, vol.27, No.5, 2016
  10. E. Suhir, “Bi-Material Assembly with a Low-Modulus-and/or-Low-Fabrication-Temperature Bonding Material at Its Ends: Optimized Stress Relief”, Journal of Materials Science: Materials in Electronics, vol.27, No.5, 2016
  11. E. Suhir, R. Ghaffarian, J. Nicolics,, “Predicted Stresses in Ball-Grid-Array (BGA) and Column-Grid-Array (CGA)  Interconnections in a Mirror-like Package Design”, Journal of Materials Science: Materials in Electronics, vol.27, No.3, 2016
  12. E. Suhir, R. Ghaffarian, J. Nicolics,  “Could Thermal Stresses in an Inhomogeneous BGA/CGA System be Predicted Using a Model for a Homogeneously Bonded Assembly?”, Journal of Materials Science: Materials in Electronics, vol.27, No. 1, 2016

2015

  1. E. Suhir,  "Predicted Stresses in a Ball-Grid-Array (BGA)/Column-Grid-Array (CGA) Assembly with a Low Modulus Solder at Its Ends", Journal of Materials Science: Materials in Electronics, vol.26, No.12, 2015
  2. E. Suhir, “Analytical Modeling Enables One to Explain Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products: Review”,  Journal of Physical Mathematics 07(01) · Dec. 2015
  3. E. Suhir, “Analysis of a Short Beam with Application to Solder Joints: Could Larger Stand-off Heights Relieve Stress?”, European Journal of Applied Physics (EPJAP), vol. 71, 2015
  4. A. Bensoussan, E. Suhir, P. Henderson, M. Zahir, “A Unified Multiple Stress Reliability Model for Microelectronic Devices — Application to 1.55 μm DFB Laser Diode Module for Space Validation”,  Microelectronics Reliability, June 2015
  5. E. Suhir, R. Ghaffarian, J. Nicolics, “Could Application of Column-Grid-Array Technology Result in Inelastic-Strain-Free State-of-Stress in Solder Material?”, Journal of Materials Science: Materials in Electronics, vol.26, No.12, 2015
  6. E. Suhir, "Analytical Bathtub Curve with Application to Electron Device Reliability", Journal of Materials Science: Materials in Electronics, vol. 26, Issue 9, 2015.
  7. E. Suhir, A. Bensoussan, and J. Nicolics, "Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen," SAE Technical Paper 2015-01-2551, 2015.

2014

  1. E. Suhir, “Human-in-the-loop (HITL): Probabilistic Predictive Modeling (PPM)  of an Aerospace Mission/Situation Outcome”, Aerospace, No.1, 2014
  2. E. Suhir and A. Bensoussan, "Quantified Reliability of Aerospace Optoelectronics," SAE Int. J. Aerosp. 7(1), 2014
  3. E. Suhir and J. Nicolics, “Analysis of a Bow-Free Pre-Stressed Test Specimen”, ASME JAM, vol.81, No.11, 2014
  4. E. Suhir, “Three-Step Concept in Modeling Reliability: Boltzmann-Arrhenius-Zhurkov Physics-of-Failure-Based Equation Sandwiched Between Two Statistical Models”, Microelectronics Reliability, Oct. 2014
  5. E. Suhir, “Compressed Cantilever Beam on an Elastic Foundation, with Application to a Dual-Coated Fiber-Optic Connector”, Int. Journal of Engineering Sciences, vol.83, Oct. 2014
  6. E. Suhir, “Human-in-the-loop: Probabilistic Predictive Modeling, Its Role, Attributes, Challenges and Applications”, Theoretical Issues in Ergonomics Science (TIES), published on line, July 2014
  7. E. Suhir, C. Bey, S. Lini, J.-M. Salotti, S. Hourlier, B. Claverie, “Anticipation in Aeronautics: Probabilistic Assessments”, Theoretical Issues in Ergonomics Science, published on line, June 2014
  8. A. Ziabari, E.Suhir, A. Shakouri, “Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelastic Module with Low Fractural Area Coverage”, Microelectronics Reliability, Vol. 45, Issue 5, May 2014
  9. E. Suihir, “Fiber Optics Engineering: Physical Design for Reliability”, Facta Universitatis: series Electronics and Energetics", Vol. 27, No 2, June 2014
  10. E. Suhir, “Thermal Stress in Through-Silicon-Vias: Theory-of-Elasticity Approach”, Microelectronics Reliability, vol.54, 2014
  11. E. Suhir, “Statistics- and Reliability-Physics-Related Failure Processes”, Modern Physics Letters B (MPLB), Vol. 28, No. 13, 2014
  12. J.-M. Salotti and E. Suhir, “Manned Missions to Mars: Minimizing Risks of Failure”, Acta Astronautica,   Vol. 93, January 2014

2013

  1. E. Suhir, S. Kang, J. Nicolics, C. Gu, A. Bensoussan, L. Bechou, “Predicted Thermal Stresses in a Cylindrical Tri-Material Body, with Application to Optical Fibers Embedded into Silicon",  J. of Electrical and Control Engineering, Vol.3 No.6, December 2013
  2. E. Suhir, “Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly”, ASME J. Appl. Mech., vol.80, January 2013
  3. E. Suhir, “How Long Could/Should be the Repair Time for High Availability?”, Modern Physics Letters B (MPLB), vol.27, Aug.30, 2013
  4. E. Suhir, “Could Electronics Reliability Be Predicted, Quantified and Assured?” Microelectronics Reliab., No. 53, April 15, 2013
  5. E. Suhir, S. Kang, “Boltzmann-Arrhenius-Zhurkov (BAZ) Model in Physics-of-Materials Problems”, Modern Physics Letters B (MPLB), vol.27, April 2013
  6. E. Suhir, “Structural Dynamics of Electronics Systems”, Modern Physics Letters B (MPLB), Vol. 27, No. 7, March 2013
  7. E. Suhir, “Thermal Stress Failures in Electronics and Photonics: Physics, Modeling. Prevention”, J. Thermal Stresses, Vol.36, No.6, June 3, 2013
  8. E. Suhir, ”“Miracle-on-the-Hudson”: Quantified Aftermath”, Int. J. Human Factors Modeling and Simulation, April 2013
  9. E. Suhir and  A.Shakouri, “Predicted Thermal Stresses in a Multi-Leg Thermoelectric Module (TEM) Design”, ASME J. Appl. Mech., vol. 80, March 2013
  10. E. Suhir,  D. Shangguan, L. Bechou, “Predicted Thermal Stresses in a Tri-Material Assembly with Application to Silicon-Based Photovoltaic Module ”, ASME J. Appl. Mech., vol.80, March 2013
  11. E. Suhir, L.Bechou, B. Levrier, “Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly”, ASME J. Appl. Mech., vol. 80, March 2013

2012

  1. W. Benhadjala, I. Bord-Majek, L. Bechou, E. Suhir, M.Buet, F. Rougé, V. Gaud, B. Plano, Y. Ousten, "Improved Performances of Polymer-Based Dielectric by Using Inorganic/Organic  Core-Shell Nanoparticles", Appl. Phys. Lett., 101, 142901, Oct. 2012
  2. E. Suhir, A. Shakouri, “Assembly Bonded at the Ends:  Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module (TEM) Design?”, ASME J. Appl. Mech., vol.79, No.6, 2012
  3. E. Suhir, “When Reliability is Imperative, Ability to Quantify It is a Must”, IMAPS Advanced Microelectronics, August 2012
  4. E. Suhir, D. Shangguan, L .Bechou, “Predicted Thermal Stresses in a Photovoltaic  Module (PVM)”, PV International (UK),  Second Quarter, May 2012
  5. E. Suhir, J. Nicolics, “Bending of a Bi-Material Cantilever Beam, with Consideration of the Role of the Interfacial Shearing Stress”, ZAMM, vol.92, No.7, 2012
  6. E. Suhir, “Likelihood of Vehicular Mission-Success-and-Safety”, J. of Aircraft, vol.49, No.1, 2012

2011

  1. E. Suhir, “Remaining Useful Lifetime (RUL): Probabilistic Predictive Model”, Int. J. of PHM, vol 2(2), 2011
  2. E. Suhir, W.Gschohsmann, J. Nicolics, “Analysis of a Bi-Material Strip”, Z. Angew. Math. Mech., 1 - 9 2011
  3. E. Suhir, “Stresses in Bi-Material GaN Assemblies”, J. Appl. Physics, 110 (7), 2011
  4. E. Suhir, “Predicted Response of the Die-Carrier Assembly to the Combined Action of Tension and Bending Applied to the Carrier in Flexible Electronics”, ASME J. Appl. Mech., vol. 79, No.1, 2011
  5. E. Suhir, C.Gu, L.Cao, “Predicted Thermal Stress in a Circular Adhesively Bonded Assembly with Identical Adherends”, ASME J. Appl. Mech, vol. 79, No.1, 2011
  6. E. Suhir, “Elastic Stability of a Rod Supported by an Elastic Foundation, with Application to Nano-Composites”, ASME J. Appl. Mech, vol. 79, No.1, 2011
  7. W. Gschohsmann, J. Nicolics, E. Suhir, “Deformations in Stretched Surface Mounted Ceramic Strips for Sensor Applications”, Microelectronics International, vol.28, Issue 3, 2011
  8. E. Suhir, “Thermal Stress Failures: Predictive Modeling Explains the Reliability Physics Behind Them”, IMAPS Advanced Microelectronics, vol.38, No.4, July/August 2011
  9. E. Suhir, “Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations”, ASME Appl. Mech. Reviews, vol. 63, No.5, March, 2011
  10. E.Suhir, “Analysis of a Pre-Stressed Bi-Material Accelerated Life Test (ALT) Specimen”, Zeitschrift fur Angewandte Mathematik und Mechanik (ZAMM), vol.91, No.5, 2011
  11. E. Suhir and R. H. Mogford, “"Two Men in a Cockpit": Probabilistic Assessment of the Likelihood of a Casualty if One of the Two Navigators Becomes Incapacitated”, J. of Aircraft, vol.48, No.4, July-August 2011

2010

  1. W. Gschohsmann, J. Nicolics,  E. Suhir, “Elastizitätsmodell eines keramischen Sensorstreifens bei longitudinaler Verformung”,  Elektrotechnik und Informationstechnik, Vol. 127, No.10, October 2010
  2. E. Suhir, “Probabilistic Modeling of the Role of the Human Factor in the Helicopter-Landing-Ship (HLS) Situation”, Int. J. Human Factor Modeling and Simulation (IJHFMS), vol.1, Issue 3, 2010
  3. E. Suhir, W. Gschohsmann, J. Nicolics, “Analysis of an Elongated Stretched Strip, With Application to a Strain-Gage Electrical Sensor Structure’, ZAMM, No.10, 2010
  4. E.Suhir, “Predicted Stresses in Die-Carrier Assemblies in “Stretchable” Electronics: Is There an Incentive for Using a Compliant Bond?”,  ZAMM, No.10, 2010
  5. E. Suhir and L.Arruda, “Could an Impact Load of Finite Duration Acting on a Duffing Oscillator Be Substituted with an Instantaneous Impulse?”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.9, 2010
  6. E. Suhir and T. Reinikainen, “Interfacial Stresses in a Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE)”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.8, 2010 
  7. E. Suhir and M.Vujosevic, “Bi-Material Assembly Subjected to Tensile Forces and Bending Moments Applied to the Ends of One of Its Components”, JSME J. Solid Mech. and Materials Engineering (JSMME), vol.4, No.4, 2010
  8. E. Suhir, “Optical Fiber Interconnects: Design for Reliability”, Society of Optical Engineers (SPIE), Proc. of SPIE, Vol. 7607 760717-8, 2010

2009

  1. E. Suhir and L. Arruda, “The Coordinate Function in the Problem of the Nonlinear Dynamic Response of an Elongated Printed Circuit Board (PCB) to a Drop Impact Applied to Its Support Contour”, European J. Appl. Physics, vol.48, No.2, 2009
  2. C.Y.Zhou, T.X.Yu, E.Suhir,  “Design of Shock Table Tests to Mimic Real-Life Drop Conditions”, IEEE CPMT Transactions, vol.32, No.4, 2009
  3. Biswas, I.S. Bayer, A. Tripathi, E.H.Lock, S.G. Walton, M.G. Norton, D.K. Avasthi, D.H.Dahanayaka, L.A.Bumm, E.Suhir, A.R.   Chowdhury, R. Gupta, “Fabrication of Nanoelectric Composites Exhibiting Stable Capacitor Functions in the High Frequency (≥100MHz) Through Interfacial Polarization Interactions”, Nanoscience and Nanotechnology Letters, vol.1, 1-8, 2009
  4. I.S. Biswas, D.H.Bayer, L.A. Dahanayaka, Z. Bumm, F, Li, R. Watanabe, Y. Sharma, A.S.. Xu, M.G. Norton, E. Suhir, “Tailored Polymer-Metal Fractal Nanocomposites: An Approach to highly Active SERS Substrates”, Nanotechnology, 20, 2009
  5. E. Suhir, “On a Paradoxical Situation Related to Bonded Joints: Could Stiffer Mid-Portions of a Compliant Attachment Result in Lower Thermal Stress?”, JSME J. Solid Mech. and Materials Engineering (JSMME),   vol.3, No.7, 2009
  6. E .Suhir, “Helicopter-Landing-Ship: Undercarriage Strength and the Role of the Human Factor”, ASME OMAE Journal, vol. 132, No.1,  Dec. 22,  2009
  7. E. Suhir, “Probabilistic Modeling of the Role of the Human Factor in the Helicopter Landing Ship (HLS) Situation”, International Journal of Human Factor Modeling and Simulation (IJHFMS),  2009
  8. E. Suhir, “Analytical Thermal Stress Modeling in Electronic and Photonic Systems”, ASME App. Mech. Reviews, invited paper, vol.62, No.4, 2009.
  9. E. Suhir and T. Reinikainen, “Interfacial  Stresess and a  Lap Shear Joint (LSJ): The “Transverse Groove Effect” (TGE)”, JSME J. Solid Mech. and Materials Engineering (JSMME),  vol.3, No.6, 2009
  10. E. Suhir,  M. Vujosevic, and T. Reinikainen,  “Nonlinear Dynamic Response of a “Flexible-and-Heavy” Printed Circuit Board (PCB) to an Impact Load Applied to Its Support Contour”, J. Appl. Physics, D, 42, No.4, 2009
  11. E. Suhir, “Thermal Stress in a Bi-Material Assembly with a “Piecewise-Continuous” Bonding Layer: Theorem of Three Axial Forces”, J. Appl. Physics, D, 42, 2009

2008

  1. E. Suhir and M. Vujosevic, “Interfacial Stresses in a Bi-material Assembly with a Compliant Bonding Layer”, J. Appl. Physics D, vol.41, 2008
  2. E. Suhir and T. Reinikainen, “On a Paradoxical Situation Related to Lap Shear Joints: Could Transverse Grooves in the Adherends Lead to Lower Interfacial Stresses?”, J.  Appl. Physics D, vol.41, 2008
  3. E. Suhir, “Lateral Compliance of a Compressed Cantilever Beam, with Application to Micro-Electronic and Fiber-Optic Structures”, J. Appl. Physics D, vol.41,No.1,  2008
  4. I.S.Bayer, A.Biswas, J.B.Szczech, E.Suhir, M.G.Norton, “Radio Frequency Functional Capacitors Made of All-Organic Composites of Thiourea in Field-Responsive Polymers for Embedded Applications”, Applied Physics Letters, vol. 92, No.1, 2008.

2007

  1. T. Mirer, D. Ingman, E. Suhir, “Reliability Improvement Through Nano-Particle-Material-Based Fiber Structures”, Optical Fiber Technology, v. 13, 2007
  2. E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber of Finite Length”, J. Appl. Physics, vol.102, No.5, 2007
  3. E. Suhir, “Response of a Heavy Electronic Component to Harmonic Excitations Applied to Its External Electric Leads”, Elektrotechnik & Informationstechnik (Austria), vol.9, 2007
  4. E. Suhir, “Elastic Stability of a Dual-Coated Optical Fiber with a Stripped Off Coating at Its End”, Journal of Applied Physics, vol. 102, No.4, 2007

2006

  1. E.Suhir, “Interfacial Thermal Stresses in a Bi-Material Assembly with a Low-Yield-Stress Bonding Layer”, Modeling and Simulation in Materials Science and Engineering, vol. 14, 2006
  2. Y. Xu, Y. Zhang, E. Suhir, and X. Wang, ” Thermal Properties of Carbon Nanotube Array for Integrated Circuits Cooling” J. Appl. Physics, 100, 074302, 2006
  3. Y. Zhang, Y. Xu and E. Suhir,  “Effect of Rapid Thermal Annealing (RTA) on Thermal Properties of Carbon Nanofibre (CNF) Arrays”, J. Appl. Physics D: Applied Physics ,39, 2006
  4. Y. Zhang, Y. Xu and E. Suhir,  “Effective Young’s Modulus of Carbon Nano-Fiber Array”,  J. Materials Research (JMR),vol.21, No.11, Nov. 2006
  5. Y. Zhang, E. Suhir, Y. Xu, and C. Gu, “ Bonding Strength of Carbon Nanofiber Array to its Substrate”,  JMR, vol. 21, No.11, Nov.2006

2003

  1. E. Suhir, “Thermal Stress in an Adhesively Bonded Joint with a Low Modulus Adhesive Layer at the Ends”, J.  Appl. Phys., April 2003
  2. E. Suhir, “Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges and Brief Review”, Special Issue, ASME J. Electr. Packaging (JEP), vol.125, No.2, June 2003
  3. E. Suhir, “Bow Free Adhesively Bonded Assemblies: Predicted Stresses”, Electrotechnik & Informationtechnik, 120 (6), June 2003

2002

  1. E. Suhir, “Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests”, ASME J. Electr. Packaging (JEP), Vol. 124, No. 3, 2002
  2. E.Suhir, “Could Shock Tests Adequately Mimic Drop Test Conditions?”, J. Electr. Packaging (JEP), July, 2002

2001

  1. E. Suhir, “Thermal Stress in a Polymer Coated Optical Glass Fiber with a Low Modulus Coating at the Ends”, J.  Mat. Res., vol. 16,  No. 10,   2001
  2. M. Ushitsky, E. Suhir, G.W. Kammlott, “Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach”, ASME J.  Electr. Pack., vol.123, No.4, 2001
  3. E. Suhir, "Analysis of Interfacial Thermal Stresses in a Tri-Material Assembly", J. Appl. Physics, vol.89, No.7, 2001
  4. E. Suhir, “Thermal Stress in a Bi-Material Assembly Adhesively Bonded at the Ends”, J. Appl. Physics, vol. 89, No.1, 2001.
  5. M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled with Particles", ASME J. Electr. Pack., vol.123, No.1, 2001

2000

  1. E. Suhir, “Microelectronics and Photonics – the Future”, Microelectronics Journal, vol.31, No.11-12, 2000
  2. E. Suhir, and J.J. Vuillamin, Jr, "Effects of the CTE and Young's Modulus Lateral Gradients on the Bowing of an Optical Fiber: Analytical and Finite Element Modeling", Optical Engineering, vol. 39, No. 12, 2000
  3. E. Suhir, “Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board”, ASME J. Electr. Packaging (JEP),  vol.122, No.1, 2000
  4. E.Suhir, “Modeling of the Mechanical Behavior of Materials in “High-Tech” Systems: Attributes and Review”, ASME J. Electr. Packaging (JEP),  vol.121, No.3, 2000
  5. E. Suhir, “Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension”, IMAPS Int. J. Microcircuits and Electronic Packaging, vol.23, No.2, 2000 (invited paper)
  6. E. Suhir, “Predicted Stresses in, and the Bow of, a Circular Substrate/Thin-Film System Subjected to the Change in Temperature”,  J. Appl. Physics, vol.88, No.5, 2000
  7. E.Suhir, “Optical Fiber Interconnect with the Ends Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in the Fiber”?, J. Appl. Physics, vol.88, No.7, 2000
  8. E. Suhir, “Adhesively Bonded Assemblies with Identical Non-deformable Adherends and “Piecewise Continuous” Adhesive Layer: Predicted Thermal Stresses and Displacements in the Adhesive”, Int. J.  Solids and Structures, vol.37, 2000

1999

  1. E. Suhir, “Adhesively  Bonded Assemblies with Identical Non-deformable Adherends: Predicted Thermal Stresses in the Adhesive Layer”, Composite Interfaces, vol.6, No.2, 1999
  2. E. Suhir, “Optimized Configuration of an Optical fiber “Pigtail” Bent on a Cylindrical Surface”, in T. Winkler and A, Schubert, eds., “Materials Mechanics, Fracture Mechanics, Micromechanics”, An Anniversary Volume in Honor of B. Michel’s 50th Birthday, Fraunhofer IZM, Berlin, 1999

1998

  1. E. Suhir, “Adhesively Bonded Assemblies with Identical Non-deformable Adherends and Inhomogeneous  Adhesive Layer: Predicted Thermal Stresses in the Adhesive”, J. Reinforced Plastics and Composites, vol.17, No.14, 1998
  2. E. Suhir, “Fiber Optic Structural Mechanics – Brief Review”, Editor’s Note, ASME J. Electr. Packaging (JEP), September 1998.
  3. E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”, ASME J. Electr. Packaging (JEP),  March 1998

1997

  1. E. Suhir, "Bending of a Partially Coated Glass Fiber Subjected to the Ends Off-Set", IEEE CPMT Transactions, June 1997.
  2. E. Suhir, “Predicted Thermal Mismatch Stresses in a Cylindrical Bi-Material Assembly Adhesively Bonded at the Ends”, ASME J. Appl. Mech., vol.64, No. 1, 1997.
  3. E. Suhir, “Is the Maximum Acceleration an Adequate Criterion of  the Dynamic Strength of a Structural Element in an Electronic Product?”, IEEE CPMT Transactions, Part A, vol.20, No.4, December 1997.
  4. E. Suhir, “Probabilistic Approach to Evaluate Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly“, IEEE CPMT Transactions, Part A, vol. 20, No. 1, 1997.
  5. E. Suhir, “Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman Equations with Consideration of Thermoelastic Strains”, Int. Journal of Solids and Structures, vol. 34, No. 12, 1997

1996

  1. E. Suhir, “Predicted Curvature and Stresses in an Optical Fiber Interconnect Subjected to Bending”, IEEE/OSA Journal of Lightwave Technology, vol. 14, No. 2, 1996
  2. E. Suhir, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load during Drop Tests: Effect of Viscous Damping”, IEEE CPMT Transactions, Part A, vol. 19, No.3, 1996
  3. E. Suhir, “Shock-Excited Vibrations of a Conservative Duffing Oscillator with Application to Shock Protection in Portable Electronics”, Int. J. Solids and Structures, vol. 33, No. 24, 1996

1995

  1. E.Suhir,‘‘Global and Local Thermal Mismatch Stresses in an Elongated Bi-Material Assembly Adhesively Bonded at the Ends,’’ Symp. on Structural Analysis in Microelectronic and Fiber Optic Systems, ASME Winter Annual Meeting, EEP/12,1995
  2. E. Suhir, “Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design”, ASME Journal of Electronic Packaging, vol. 117, No. 4, 1995
  3. E. Suhir, “Shock Protection with a Nonlinear Spring”, IEEE CPMT Transactions, Advanced Packaging, Part B, vol. 18, No. 2, 1995
  4. E. Suhir, “How Compliant Should a Die-Attachment Be to Protect the Chip From Substrate (Card) Bowing?”, ASME J. Electr. Packaging (JEP),  vol. 117, No. 1, 1995

1994

  1. E. Suhir, “Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate”, ASME J. Electr. Packaging (JEP), vol. 116, No. 3, 1994
  2. E. Suhir E., “Dynamic Response of a Rectangular Plate to a Shock Load, with Application to Portable Electronic Product,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.17, No. 3, 1994.
  3. E. Suhir, “Approximate Evaluation of the Interfacial Shearing Stress in Circular Double Lap Shear Joints, with Application to Dual-Coated Optical Fibers”, Int. Journal of Solids and Structures, vol. 31, No. 23, 1994
  4. E. Suhir, “Thermally Induced Stresses in an Optical Glass Fiber Soldered into a Ferrule”, IEEE/OSA Journal of Lightwave Technology, vol. 12, No. 10, 1994
  5. E. Suhir, “Pull Testing of a Glass Fiber Soldered into a Ferrule: How Long Should the Test Specimen Be?”, Applied Optics, vol. 33, No. 19, 1994
  6. E. Suhir and R. Burke, “Analysis and Optimization of the Dynamic Response of a Rectangular Plate to a Shock Load Acting on Its Support Contour, With Application to Portable Electronic Products”, IEEE CHMT Transactions, Advanced Packaging, Part B, vol. 17, No. 3, 1994

1993

  1. E. Suhir, “Can the Curvature of an Optical Glass Fiber be Different from the Curvature of Its Coating?”, Int. J. Solids and Structures, vol. 30, No. 17, 1993
  2. E. Suhir, “Predicted Stresses and Strains in Fused Biconical Taper Couplers Subjected to Tension”, Applied Optics, vol. 32, No. 18, 1993
  3. E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Applied Optics, vol. 32, No. 16, 1993
  4. E. Suhir, “Effect of the Nonlinear Stress-Strain Relationship on the Maximum Stress in Silica Fibers Subjected to Two-Point Bending”, Applied Optics, vol. 32, No. 9, 1993
  5. E. Suhir, “Analytical Modeling of the Interfacial Shearing Stress During Pull-Out Testing of Dual-Coated Lightguide Specimens”, Applied Optics, vol. 32, No. 7, 1993
  6. E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices”, J. Reinforced Plastics and Composites, vol. 12, Sept. 1993
  7. V. Mishkevich and E. Suhir, “Simplified Approach to the Evaluation of Thermally Induced Stresses in Bi-Material Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1993
  8. E. Suhir, C. Paola, W. M. MacDonald, “Input/Output Fiber Configuration in a Laser Package Design”, IEEE/OSA J. Lightwave Technology, vol. 11, No. 12, 1993

1992

  1. E. Suhir, “Free Vibrations of a Fused Biconical Taper Lightwave Coupler”, Int. J. Solids and Structures, vol. 29, No. 24, 1992
  2. E. Suhir, “Vibration Frequency of a Fused Biconical Taper (FBT) Lightwave Coupler”, IEEE/OSA Journal of Lightwave Technology, vol. 10, No. 7, 1992
  3. E. Suhir, “The Effect of the Nonlinear Behavior of the Material on Two-Point Bending in Optical Glass Fibers”, ASME J. Electr. Packaging (JEP),  vol. 114, No. 2, 1992
  4. E. Suhir, “Elastic Stability, Free Vibrations, and Bending of Optical Glass Fibers: The Effect of the Nonlinear Stress-Strain Relationship”, Applied Optics, vol. 31, No. 24, 1992
  5. E. Suhir, “Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to Its Support Contour”, ASME J. Appl. Mech, vol. 59, No. 2, 1992
  6. E. Suhir, “Nonlinear Dynamic Response of a  Flexible Thin Plate to Constant Acceleration Applied to Its Support Contour, with Application to Printed Circuit Boards Used in Avionic Packaging”, Int. J. Solids and Structures, vol. 29, No. 1, 1992
  7. E. Suhir and L. T. Manzione, “Predicted Bow of Plastic Packages Due to the Non-uniform Through-Thickness Distribution of Temperature”, ASME J. Electr. Packaging (JEP), vol. 114, No. 3, 1992

1991

  1. E. Suhir, “Approximate Evaluation of the Elastic Interfacial Stresses in Thin Films with Application to High-Tc Superconducting Ceramics”, Int. J. Solids and Structures, vol. 27, No. 8, 1991
  2. E. Suhir, “Stress Relief in Solder Joints Due to the Application of a Flex Circuit”, ASME J. Electr. Packaging (JEP),  vol. 113, No. 3, 1991
  3. E. Suhir, G. M. Bubel, and R. D. Tuminaro, “Predicted Curvature of the Glass Fiber from the Measured Curvature of Its Coating”, IEEE/OSA Journal of Lightwave Technology, vol. 9, No. 6, 1991
  4. E. Suhir and L. T. Manzione, “Predicted Stresses in Wire Bonds of Plastic Packages during Transfer Moldings”, ASME J. Electr. Packaging (JEP), vol. 113, No. 1, 1991
  5. E. Suhir, “A Plate Contactor in a Mechanical Input/Output Connector Interface: How Small Can It Be?”, ASME J. Electr. Packaging (JEP), vol. 113, No. 1, 1991
  6. E. Suhir and L. T. Manzione, “Mechanical Deformation of Lead Frame Assemblies in Plastic Packages during Molding”, ASME J. Electr. Packaging (JEP), vol. 113, No. 4, 1991

1990

  1. E. Suhir, "Calculated Stresses in Dual-Coated Optical Fibers", Polymer Eng. & Sci., 30, 1990
  2. E. Suhir, “Stresses in a Coated Fiber Stretched on a Capstan”, Applied Optics, vol. 29, No. 18, 1990
  3. E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, ASME J. Electr. Packaging (JEP), vol. 112, No. 4, 1990
  4. E. Suhir, “Buffering Effect of Fiber Coating and Its Influence on the Proof-Test Load in Optical Fibers”, Applied Optics, vol. 29, No. 18, 1990
  5. E. Suhir, “Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 8, No. 6, 1990
  6. E. Suhir, “Double-Sided Velcro-Type Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors”, ASME J. Electr. Packaging (JEP), vol. 112, No. 4, 1990
  7. E. Suhir and B. Poborets, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, ASME J. Electr. Packaging (JEP), vol. 112, No. 2, 1990
  8. E. Suhir, “How Long Should a Beam Specimen Be in Bending Tests?”, ASME J. Electr. Packaging (JEP), vol. 112, No. 1, 1990
  9. E. Suhir, “Predicted Mechanical Behavior of High-Tc Superconducting Ceramic Films”, in T. Venkatesan, ed., “Processing of Films for High-Tc Superconducting Electronics”, SPIE, Vol. 1187, 1990
  10. E. Suhir and T. M. Sullivan, “Analysis of Interfacial Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders”, Int. J. Solids and Structures, vol. 26, No. 6, 1990
  11. E. Suhir and W. E. Benedetto, “Mechanical Behavior of the “Euler” Test Probe”, ASME J. Electr. Packaging (JEP),  vol. 112, No. 1,1990

1989

  1. E. Suhir, “Interfacial Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 56, No. 3, September 1989
  2. E. Suhir, “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques”, ASME J. Electr. Packaging (JEP), vol. 111, No. 2, June 1989
  3. E. Suhir, “Axisymmetric Elastic Deformations of a Finite Circular Cylinder with Application to Low Temperature Strains and Stresses in Solder Joints”, ASME J. Appl. Mech., vol. 56, No. 2, 1989
  4. E. Suhir, “Applications of an Epoxy Cap in a Flip-Chip Package Design”, ASME J. Electr. Packaging (JEP), vol. 111, No. 1, 1989
  5. E. Suhir, “Bending Performance of Clamped Optical Fibers: Stresses Due to the End Off-Set”, Applied Optics, vol. 28, No. 3, February 1989.
  6. E. Suhir, “Can Power Cycling Life of Solder Joint Interconnections Be Assessed on the Basis of Temperature Cycling Tests?”, ASME J. Electr. Packaging (JEP),  vol. 111, No. 4, Dec. 1989.
  7. E. Suhir, “Calculated Interfacial Stresses in Elongated Bi-Material Plates Subjected to Bending”, ASME J. Electr. Packaging (JEP),  vol. 111, No. 4, Dec. 1989.
  8. E. Suhir, “Twist-off Testing of Solder Joint Interconnections”, ASME J. Electr. Packaging (JEP), vol. 111, No. 3, Sept. 1989.

1988

  1. E. Suhir, “Stresses in Dual - Coated Optical Fibers”, ASME J. Appl. Mech., vol. 55, No. 10, 1988.
  2. E. Suhir, “Spring Constant In the Buckling of Dual-Coated Optical Fibers”, IEEE/OSA J. Lightwave Technology., vol. 6, No. 7, 1988.
  3. E. Suhir, “Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 6, No. 8, 1988.
  4. E. Suhir, “An Approximate Analysis of Stresses in Multilayer Elastic Thin Films”, ASME J. Appl. Mech., vol. 55, No. 3, 1988.
  5. E. Suhir, “On a Paradoxical Phenomenon Related to Beams on Elastic Foundation”, ASME J. Appl. Mech., vol. 55, No. 10, 1988.

1987

  1. E. Suhir, ‘‘Stresses in Multilayered Thin Films on a Thick Substrate, Heteroepitaxy-on-Silicon II,’’ MRS Symp.Proc, 91, 1987

1986

  1. E. Suhir, “Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 53, No. 3, Sept. 1986.
  2. S. Luryi and E. Suhir, “A New Approach to the High-Quality Epitaxial Growth of Lattice - Mismatched Materials”, Applied Physics Letters, vol. 49, No. 3, July 1986.

1982

  1. E. Suhir, “Shock-Excited Vibrations with Application to the Slamming Response of a Flexible Ship to a Regular Wave Packet”, SNAME J. Ship Research, vol. 26, No. 4, 1982.

Peer Reviewed Conference Presentations and Publications

2019

  1. E.Suhir, “Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated Testing”, IMAPS, Boston, October 1-4, 2019
  2. E.Suhir, “Probabilistic Risk Analysis in Aerospace Human-in-the-Loop Tasks: Review and Extension”,   Human Systems Integration (HIS-2019) Conf., Biarritz, France, Sept.11 - 13, 2019 (Plenary address)
  3. E.Suhir, “Solder Joint Interconnections in Aerospace Electronics: Design-for-Reliability and Accelerated Testing”, IEEE_MetroAeroSpace Conf., Torino, Italy, June19-21, 2019 
  4. E. Suhir, “Design-for-Reliability of IC Packages Employing Ceramics, 2019 IEEE-ISSE – Advances in Printed and Ceramic Microsystems”, Wrozlaw, Poland, May 16-17, 2019
  5. E.Suhir, “Probabilistic Design for Reliability in Electronics and Photonics:  Role, Attributes, Challenges”, Univ. of Illinois at Urbana-Champaign, March 12, 2019
  6. E. Suhir, S.Yi, J.Nicolics, “Failure-Oriented-Accelerated-Testing (FOAT) vs. Highly-Accelerated-Life-Testing (HALT): Making a Viable Medical Electron Device (MED) Package into a Reliable Product”,  IMAPS Workshop on Advanced Packaging for Medical Microelectronics,  San Diego, California, January 23-25, 2019

2018

  1. E,Suhir,  J.Hwang,R.Ghaffarian, “Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief”, IMAPS Conf., Pasadena, CA, 8-12 Oct., 2018
  2. E.Suhir, “Reliability of an Electronic Product Fabricated of Mass-Produced Components”,  IMAPS Conf., Pasadena, CA, 8-12 Oct., 2018
  3. E. Suhir, “Probabilistic Design for Reliability (PDfR) of Aerospace Instrumentation: Role, Significance, Attributes, Challenges , 5th IEEE International Workshop on Metrology for  Aerospace (MetroAeroSpace), Rome, Italy, Plenary Lecture, June 20-22, 2018
  4. E. Suhir, S. Yi, “Accelerated Testing and Predicted Useful Lifetime of Medical Electronics”, Handlery Hotel, San-Diego, IMAPS Conf. on Advanced Packaging for Medical Electronics, Jan.23-24, 2017

2017

  1. E. Suhir, S. Yi, “Elastic Stability of a Dual-Coated Fiber-Optic Connector”, 2017 SPIE Photonics West, Feb.1,San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.
  2. E. Suhir, S. Yi,”Thermal Stress in an Optical Silica Fiber Embedded (Soldered) into Silicon”,  2017 SPIE Photonics West, Jan. 31, San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.
  3. E. Suhir, S. Yi, “Predicted Lattice-Misfit Stresses in a Gallium-Nitride (GaN) Film”,   2017 SPIE Photonics West, Jan.30, San Francisco, published in the SPIE Digital Library as part of the proceedings of the Silicon Photonics XII conference.
  4. E. Suhir, S. Yi, J. Nicolics, L. Bechou, W.Benhadjala, “How Swiftly Should Be a Product Repaired, so that Its Availability is not Compromised?”, EuroSimE, 2017, Dresden, Germany
  5. E.Suhir, S.Yi, “Double Exponential Probability Distribution Function (DEPDF) and Its Applications to Human-in-the-Loop (HITL) Aerospace Problems: When Human Performance Is Imperative, Ability to Quantify It is a Must”, Special NDA Session at the AIAA SciTech Conf., Jan. 9-13, 2017, Gaylord Texan Resort & Convention Center
  6. E.Suhir, S.Yi, “Design-for-Reliability and Accelerated Testing of Aerospace Electronics: What Should Be Done Differently”, Special NDA Session at the AIAA SciTech Conf., Jan. 9-13, 2017, Gaylord Texan Resort & Convention Center
  7. E.Suhir, S.Yi, J.Nicolics, “Statistics- and Reliability Physics Related Failure Rates”,  IRPS, Monterey, April 2-6, 2017
  8. E.Suhir, S.Yi, J.Nicolics, “When Equipment Reliability and Human Performance Contribute Jointly to Vehicular Mission Success and Safety, Ability to Quantify Its Outcome is a Imperative”,   IRPS, Monterey, April 2-6, 2017

2016

  1. E. Suhir, S. Yi, “Predicted Thermal Stresses in a TSV Design”, San-Francisco, CA, Nov.8-10, 2016
  2. E.Suhir, S.Yi, “Probabilistic Design for Reliability of Medical Electronic Devices: Role, Significance, Attributes, Challenges”, IEEE Medical Electronics Symp., Portland, OR, Sept. 14-15, 2016
  3. E. Suhir, L. Bechou, R. Ghaffarian, J. Nicolics, “Column-Grid-Array (CGA) Technology Could Lead to a Highly Reliable Package Design”, IEEE Aerospace Conference, Big Sky, Montana, March 5-12, 2016
  4. E.Suhir, J.Nicolics, and S. Yi, "Probabilistic Predictive Modeling (PPM) of Aerospace Electronics (AE) Reliability: Prognostic-and-Health-Monitoring (PHM) Effort Using Bayes Formula (BF), Boltzmann-Arrhenius-Zhurkov (BAZ) Equation and Beta-Distribution (BD)", 2016 EuroSimE Conf., Montpelier, France, 2016
  5. E. Suhir, M. Unger, L. Cvitkovich, and J. Nicolics, “Power Core Embedding a Plurality of IC Devices and Sandwiched Between Two Insulated Metal Substrates: Predicted Thermal Stresses”, 2016 EuroSimE Conf., Montpelier, France, 2016
  6. E.Suhir, J.Nicolics, “Aerospace Electronics-and-Photonics (AEP) Reliability Has to be Quantified to be Assured”, AIAA SciTech Conf., San Diego, CA, January 2016

2015

  1. E. Suhir, A. Bensoussan, J. Nicolics, “Bow-Free Pre-Stressed ALT Specimen”, SAE Conf., Seattle, WA, Sept. 22-24, 2015
  2. E. Suhir, "Analytical Modeling Enables One to Explain Paradoxical Situations in the Behavior and Performance of Electronic Materials and Products" (keynote presentation), Int. Conf. on Materials, Processing and Products Engineering (MPPE), Leoben, Austria, Nov. 3-5, 2015
  3. E. Suhir, G. Khatibi, J. Nicolics, M. Lederer, "Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of the Lattice-Misfit Stresses”, Ibid.
  4. A. Bensoussan, E. Suhir, P. Henderson, M. Zahir, “A Unified Multiple Stress Reliability Model for Microelectronic Devices: Application to 1.55 DFB Laser Diode Module for Space Validation”, ESREF, Toulouse, France, Oct. 2015
  5. E. Suhir, A. Bensoussan, “Degradation Related Failure Rate Determined from the Experimental Bathtub Curve”, SAE Conf., Seattle, WA, Sept. 22-24,.2015
  6. E. Suhir, “Human-in-the-Loop and Aerospace Navigation Success and Safety: Application of Probabilistic Predictive Modeling”, SAE Conf., Seattle, WA, Sept. 22-24, .2015
  7. E. Suhir, “Failure Oriented Accelerated Testing (FOAT), and Its Role in Making a Viable VLSI Device into a Reliable Product, 2015 IEEE VLSI Test Symp. Silverado Resort and Spa, Napa, CA, April 27-29, 2015
  8. E. Suhir, A. Bensoussan, G. Khatibi, J. Nicolics, “Probabilistic Design for Reliability in Electronics and Photonics: Role, Significance, Attributes, Challenges”, IRPS, Hyatt Regency Monterey Resort & Spa, Monterey, CA, USA, April 19-23, 2015
  9. E. Suhir,  “Analytical Stress Modeling for TSVs in 3D Packaging”, Semi-Term, San-Jose, March 15-19, 2015
  10. E. Suhir, L. Bechou, “Thermal Stress in an Electronic Package Sandwiched Between Two Identical Substrates”,  IEEE Aerospace Conference, Big Sky, Montana, March 5-12,  2015E
  11. E. Suhir, “Assessment of Product’s Degradation Rate from the Measured Bathtub Curve Data”, 2015 IEEE Aerospace Conference, Big Sky, Montana, March 5-12, 2015
  12. E. Suhir, “Analytical Predictive Modeling in Fiber Optics Structural Analysis: Review and Extension”, SPIE, San-Francisco, February 10, 2015
  13. E. Suhir, “Stress Related Aspects of the Physics of GaN Material Growth”, SPIE, San-Francisco, February 10, 2015

2014

  1. E.Suhir,” Reliability Physics and Probabilistic Design for Reliability (PDfR): Role, Attributes, Challenges”  EPTC 2014, Singapore, November 5th, 2014 (invited)
  2. G. Khatibi, B.Czerny, J.Magnien, M.Lederer, E.Suhir, J. Nicolics, “Towards Adequate Qualification Testing of Electronic Products: Review and Extension”, EPTC 2014, Singapore, November 5th, 2014 (invited)
  3. E. Suhir, A. Bensoussan, “Quantified Reliability of Aerospace  Optoelectronics”, SAE Aerospace Systems and Technology Conference, September 23-25 2014 — Cincinnati, OH, USA
  4. Z. Remili, Y. Ousten, B. Levrier, D. Mercier, E. Suhir, L. Bechou, “Thermo-mechanical Stress Analysis of Copper/Silicon Interface in Through Silicon Vias using FEM simulations and experimental analysis”, IEEE CPMT ESTC Conference, Helsinki, 2014
  5.  V. Murashev, S. Legotin, K. Tapero, E.Suhir,  “Asynchronous Scanning Photo-receiver Based on Injection-Coupled Device”, 2014 ISROS Conference, June 2014
  6. J.-M. Salotti, R. Hedmann, E.Suhir, “ Crew Size Impact on the Design, Risks and Cost of a Human Mission to Mars”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
  7. E.Suhir, A. Bensoussan, L. Bechou, “Aerospace Electronic Packaging: Thermal Stress in Bi- and Tri-Material Assemblies”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
  8. E.Suhir, A.Bensoussan, “Application of Multi-parametric BAZ Model in Aerospace Optoelectronics”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
  9. E. Suhir, A.Bensoussan, J.Nicolics, L.Bechou, “Highly Accelerated Life Testing (HALT), Failure Oriented Accelerated Testing (FOAT), and Their Role in Making a Viable Device into a Reliable Product”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
  10. J.-M. Salotti, E. Suhir, “Some Major Guiding Principles for Making  Future Manned Missions to Mars Safe and Reliable”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
  11. V. N. Murashev, P.A. Ivshin, S.A.Legotin, K. Tapero, E. Suhir, “Injection-coupled Devices (ICDs): Operation Principle, Applications, Design-for-Reliability”,  2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
  12. D. Gucik-Derigny, A. Zolghadri. L. Bechou, E. Suhir, “Prediction of Remaining Useful Life (RUL) of Ball-Grid-Array (BGA) Interconnections During Testing on the Board Level”, 2014 IEEE Aerospace Conference, Big Sky, Montana, March 2014
  13. E. Suhir, “Failure-Oriented-Accelerated-Testing (FOAT) and Its Role in Making a Viable Package into a Reliable Product”, SEMI-TERM 2014, San Jose, CA, March 9-13, 2014
  14. D. Gucik-Derigny, A. Zolghadri, E. Suhir, L. Bechou, "A Model-Based Prognosis Strategy for Prediction of Remaining Useful Life of Ball-Grid-Array Interconnections", 19th World Congress of the International Federation of Automatic Control,  Cape Town, South Africa, August 24-29, 2014

2013

  1. E. Suhir, L. Bechou,  “Saint-Venant’s Principle and the Minimum Length of a Dual-Coated Optical Fiber Specimen in Reliability (Proof) Testing”, ESREF, Arcachon, France, 2013 
  2. E. Suhir, L. Bechou, A.Bensoussan, J. Nicolics “Photovoltaic Reliability Engineering: Qualification Testing (QT) and Probabilistic Design-for-Reliability (PDfR) Concept”,  invited presentation, 2013 SPIE PV Reliability Conference, San Diego CA, August 2013
  3. W. Benhadjala, I. Bord-Majek, L. Béchou, E. Suhir, M. Buet, F. Rougé, V. Gaud. and Y. Ousten, “Effect of Processing Factors on Dielectric Properties  of BaTiO3/Hyperbranched Polyester Core-Shell Nano-Particles”, ECTC,  San Diego, May 2013
  4. A. Bensoussan and E. Suhir, “Design-for-Reliability (DfR) of Aerospace Electronics: Attributes and Challenges",  2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
  5. E. Suhir, “Assuring Aerospace Electronics and Photonics Reliability: What Could and Should Be Done Differently”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
  6. E. Suhir, “Predicted Reliability of Aerospace Electronics: Application of Two Advanced Probabilistic Techniques”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
  7. E. Suhir, L .Bechou, B. Levrier, D. Calvez, “Assessment of the Size of the Inelastic Zone in a BGA Assembly”, 2013 IEEE Aerospace Conference, Big Sky, Montana, March 2013
  8. E. Suhir, “Elastic Stability of a Dual-Coated Fiber”, SPIE Paper #8621-37, Photonics West, February 2013

2012

  1. E.Suhir, “Thermal Stress in Electronics and Photonics: Prediction and Prevention”, Keynote presentation, Therminic, Budapest, September 2012
  2. E.Suhir, “Dynamic Response of Electronic Systems to Shocks and Vibrations: Application of Analytical (Mathematical) Modeling”, 2012 DYMAT Conference
  3. E. Suhir, R. Mahajan, A. Lucero, L. Bechou, “Probabilistic Design for Reliability (PDfR) and a Novel Approach to Qualification Testing (QT)”, 2012 IEEE/AIAA Aerospace Conf., Big Sky, Montana, 2012
  4. B. Nagl, E.Suhir, W. Gschohsmann, J.Nicolics, “Transient Thermo-Mechanical Study of a Thick-Wire Bond with Particular Attention to the Interfacial Shearing Stress”,  Int. Spring Seminar on Electronics Technology (ISSE), 09-13, Bad Aussee, Austria, May 2012
  5. W. Benhadjala, I. Bord,  L. Béchou, E. Suhir,  M. Buet, F. Rougé,  Y. Ousten,  “Novel Core-Shell Nanocomposite for RF Embedded Capacitors:  Processing and Characterization”,  2012 ECTC , June 2012

2011

  1. E.Suhir, "Human-in-the-Loop”: Likelihood of a Vehicular Mission-Success-and-Safety, and the Role of the Human Factor”, Paper ID 1168, 2011 IEEE/AIAA Aerospace Conference, Big Sky, Montana, March 5-12, 2011

2009

  1. E. Suhir, “Stretchable Electronics: Does One Need a Good Thermal Expansion Match Between the Si Die and the Plastic Carrier?” , IEEE ECTC 2009
  2. T. Reinikainen and E.Suhir, “Novel Shear Test Methodology for the Most Accurate Assessment of Solder Material Properties”, IEEE ECTC 2009
  3. E. Suhir, “Lateral Compliance and Elastic Stability of a Dual-Coated Optical Fiber of Finite Length, with Application to Nano-Rods Embedded in Low-Modulus Elastic Media”, IEEE ECTC 2009 
  4. E.Suhir, “Helicopter-Landing-Ship: Undercarriage Strength and the Role of the Human Factor”, ASME OMAE Conference, June 1-9, Honolulu, Hawaii, 2009;

2008

  1. E. Suhir and S. Savastiuk, “Disc-like Copper Vias Fabricated in a Silicon Wafer:  Design for Reliability”,  58-th IEEE ECTC 2008

2007

  1. E. Suhir, “Dynamic Response of Micro-Electronic Structural Elements to Shocks and Vibrations”, Keynote presentation, MicroNanoReliability Congress, Berlin-Koepenick, September 2-5, 2007
  2. E. Suhir, “Polymer Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System”, Keynote Presentation,  Polytronic’2007, Proceedings of the International Conference on Polymeric Materials for Micro- and Opto-Electronics Applications, Tokyo, Japan, January 14-16, 2007

2006

  1. Yi. Zhang, Yuan Xu, Claire Gu and Ephraim Suhir, “Predicted Shear-off Stress in Bonded Assemblies: Review and Extension” ASTR 2006, San Francisco, CA, 2006
  2. E. Suhir, “Fiber Optics Structural Mechanics, and a New Generation of Nano-Technology Based Optical Fiber Cladding and Coating”, Invited talk at the Photonics West Conf., and SPIE Publication, 2006
  3. E. Suhir, D. Ingman, “Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications”, ECTC’06 Proceedings, San Diego, May 2006

2005

  1. E. Suhir, “Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results”, Invited Talk, Therminic, 2005, Lago Maggiore, Italy, September 27-30, 2005
  2. E. Suhir, “Mechanics of Coated Optical Fibers: Review and Extension”, ECTC’2005, Orlando, Florida, 2005
  3. E. Suhir, “Microelectronic and Photonic Systems: Role of Structural Analysis”, InterPack’2005 Conference, San Francisco, July 2005
  4. E. Suhir, “New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Packaging Applications”, IEEE Workshop on Advanced Packaging Materials, Irvine, March 2005.

2004

  1. E. Suhir, “Bow-Free Assemblies: Predicted Stresses”, Therminic’2004, Niece, France, Sept. 29-Oct.1, 2004
  2. E. Suhir, “Polymer Coated Optical Glass Fiber Reliability: Could Nano-Technology Make a Difference?”, Polytronic’04, Portland, OR, September 13-15, 2004

2003

  1. E. Suhir, “Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension”, Invited Presentation, ASME Symposium Dedicated to Dr. Richard Chu, IBM, Washington, DC, November 2003
  2. E. Suhir, “Polymer Coated Optical Glass Fibers: Review and Extension”, Proceedings of the POLYTRONIK’2003, Montreaux, October 21-24, 2003.
  3. E. Suhir, V.Ogenko, D. Ingman, “Two-Point Bending of Coated Optical Fibers”, Proceedings of the PhoMat’2003 Conference, San-Francisco, CA, August 2003
  4. E. Suhir, “How to Make a Photonic Device Into a Product: Role of Accelerated Life Testing”, Keynote Address at the International Conference of Business Aspects of Microelectronic Industry, Hong-Kong, January 2003.

2002

  1. E.Suhir, “Could Shock Tests Adequately Mimic Drop Test Conditions?”, IEEE ECTC Conference Proceedings, San-Diego, CA, May 28-31, 2002

2001

  1. E. Suhir, “Adequate Underkeel Clearance (UKC) for a Ship Passing a Shallow Waterway: Application of the Extreme Value Distribution (EVD)”, Proceedings of OMAE2001 Conference, Paper OMAE2001/S&R-2113, Rio de Janeiro, Brazil, 2001

2000

  1. A. Katz, M. Pecht, E. Suhir, “Accelerated Testing in Microelectronics: Review, Pitfalls and New Developments”, Proceedings of the International Symposium on Microelectronics and Packaging, IMAPS, Israel, 2000
  2. E.Suhir, “The Future of Microelectronics and Photonics, and the Role of Mechanical, Materials and Reliability Engineering”, Proceedings of the International Conference on Materials in Microelectronics, MicroMat 2000, April 17-19, 2000, Berlin, Germany
  3. E.Suhir, “Silica Optical Fiber Interconnects: Design for Reliability”, Proceedings of the Annual Conference of the American Ceramic Society, St.-Louis, MO, May 3, 2000

1999

  1. E.Suhir, “Elastic Stability of the Glass Fibers in a Micromachined Fiber-Optic Switch Packaged into a Dual-in-Line Ceramic Package”, ECTC, 1999

1998

  1. E. Suhir, “Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.
  2. E. Suhir, “Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?”, International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29- Dec.2, 1998, ASME Press, 1998.
  3. E. Suhir, “Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set”, MRS Symp. Proc., vol. 531, 1998.
  4. E. Suhir, “Optical Fiber Interconnect Subjected to a Not-Very-Small Ends Off-Set: Effect of the Reactive Tension”, MRS Symposia Proceedings, vol. 531, 1998.
  5. E. Suhir, “’Optical Glass Fiber Bent on a Cylindrical Surface”, MRS Symposia Proceedings, vol.531, 1998.

1997

  1. E. Suhir, “Dynamic Response of Microelectronics and Photonics Systems to Shocks and Vibrations”, Proceedings of the International Conference on Microelectronics and Photonics Packaging, INTERPack’97, Hawaii, June 15-19, 1997.
  2. E. Suhir, “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure”, IMAPS/NATO Workshop Proceedings, Bled, Slovenia, 1997
  3. E. Suhir, “The Future of Microelectronics and Photonics and the Role of Mechanics and Materials”, Proceedings of the Electronic Packaging and Technology Conf., EPTC’97, Singapore, October 1997.
  4. E. Suhir, "Bending of a Partially Coated Glass Fiber Subjected to the Ends Off-Set", Proc. of the 47-th Electr. Comp. and Techn. Conference, IEEE, San Jose, CA, May 1997, see also IEEE CPMT Transactions, June 1997.
  5. E. Suhir, “Solder Materials and Joints in Fiber Optics: Reliability Requirements and Predicted Stresses”, Proc. of the Int. Symp. on “Design and Reliability of Solders and Solder Interconnections”, Orlando, Fl., Febr. 1997.
  6. M. Uschitsky and E. Suhir, “Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, ASME Press, 1997.

1996

  1. B. Welker, M. Uschitsky, E. Suhir, S. Kher, G. Bubel, “Finite Element Analysis of the Optical Fiber Structures”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996
  2. E. Suhir, “Flex Circuit  vs  Regular” Substrate: Predicted Reduction in the Shearing Stress in Solder Joints”, Proc. of the 3-rd Int. Conf. on Flexible Circuits FLEXCON 96, San-Jose, CA, Oct. 1996.
  3. M. Uschitsky, E. Suhir, L. Shepherd, W.R. Lambert, and M.A. Zimmerman, “Predicted Dynamic Strength and Durability of a Network Interface Unit (NIU) Enclosure”, in E. Suhir, ed., Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.
  4. E. Suhir, and Q.S.M. Ilyas, ““Thick” Plastic Packages With “Small” Chips vs “Thin” Packages With “Large” Chips: How Different is Their Propensity to Moisture Induced Failures?”, in E. Suhir, ed., “Structural Analysis in Micro-electronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.
  5. M. Uschitsky, E. Suhir, “Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1996.

1995

  1. M. Uschitsky, E. Suhir, S. Kher, and G. Bubel, “Epoxy Bonded Optical Fibers: the Effect of Voids on Stress Concentration in the Epoxy Material”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber Optic Systems”, Symposium Proceedings, ASME Press, 1995.
  2. E. Suhir, “Predicted Failure Criterion (von-Mises Stress) in Plastic Packages During High Temperature Reflow Soldering”, 45-th ECTC Proceedings, Las Vegas, May 1995.
  3. E. Suhir, V. Mishkevich, and J. Anderson, “How Large Should a Periodic External Load Be to Cause Appreciable Microbending Losses in a Dual-Coated Optical Fiber?”, in E. Suhir, ed., “Structural Analysis in Microelectronics and Fiber Optics”, Symposium Proceedings, ASME Press, 1995.
  4. E. Suhir, “Global” and “Local” Thermal Mismatch Stresses in an Elongated Bi-Material Assembly Bonded at the Ends”, in E. Suhir, ed., “Structural Analysis in Microelectronic and Fiber-Optic Systems”, Symposium Proceedings, ASME Press, 1995.

1993

  1. E. Suhir, “Mechanical Reliability of Flip-Chip Interconnections in Silicon-on-Silicon Multichip Modules”, IEEE Conference on Multichip Modules, IEEE, Santa Cruz, Calif., March 1993.
  2. E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 2, “The Case of a Specimen Embedded into Epoxy”, ANTEC-93,  May 1993, SPE, New Orleans, Louisiana.
  3. E. Suhir, “Predicted Interfacial Shearing Stress in Dual-Coated Optical Fiber Specimens Subjected to Tension”, Part 1, “The Case of a Cylindrical Double Lap Shear Joint”, ANTEC-93, May 1993, SPE, New Orleans, Louisiana.

1992

  1. E. Suhir and T. M. Sullivan, “Novel Technique for the Evaluation of the Adhesive Strength of the Epoxy Molding Compounds Used in Plastic Packaging”, 42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.
  2. E. Suhir, “Mechanical Behavior and Reliability of Solder Joint Interconnections in Thermally Matched Assemblies”,  42-nd Electr. Comp. and Techn. Conf., IEEE, San-Diego, Calif., May 1992.
  3. E. Suhir, “Predicted Bow of Plastic Packages of Integrated Circuit (IC) Devices”, 50-th SPE Conf., SPE, Detroit, MI, May 1992. 

1991

  1. E. Suhir, “Nonlinear Dynamic Response of a Flexible Printed Circuit Board to Shock Loads Applied to Its Support Contour”, 41-st Elect. Comp. and Techn. Conf., IEEE, Atlanta, Georgia, May 1991.
  2. E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber Optic Systems: Application of Analytical Modeling-Review”, MRS Symposia Proc., vol. 226, 1991.

1990

  1. E. Suhir and B. Poborets, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, 40th Elect. Comp. and Techn. Conf., Las Vegas, Nevada, May 1990;

1989

  1. E. Suhir, “Calculated Stresses in Microelectronic and Fiber-Optic Structures”, Proc. of the 1st Pan American Congress of Applied Mechanics, American Academy of Mechanics, Rio de Janeiro, Brazil, January 1989.
  2. E. Suhir, “Mechanical Behavior of Materials in Microelectronic and Fiber-Optic Systems: Application of Analytical Modeling-Review”, ASME 89-WA/EEP-16, 1989 Winter Annual Meeting, San-Francisco, December 1989.
  3. E. Suhir, “Thermally Induced Stresses in Elongated Bi-Material Plates”, Applied Mechanics Reviews, 1989 Supplement, “Mechanics Pan America 1989, Selected and Revised Proceedings of the January 1989 Rio de Janeiro Pan American Congress of Applied Mechanics,  C. R. Steele, A. W. Leissa and M. R. M. Crespo de Silva, eds., vol. 42, No. 11, part 2, Nov. 1989.

1988

  1. E. Suhir and J. M. Segelken, "Mechanical Behavior of Flip-Chip Encapsulants”, Semicon/East Technical Proc., Semiconductor Equipment and Materials International, Boston, Mass., Sept. 1988.
  2. E. Suhir, “Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?”, Proc. of the 38th Electr. Comp. Conf., IEEE, Los Angeles, Calif., May 1988.
  3. E. Suhir, “Calculated Stresses in Dual-Coated Fibers”, Proc. of the SPE 46th Annual Technical Conference, ANTEC '88, Atlanta, Georgia, May 1988.

1987

  1. E. Suhir, “Die Attachment Design and Its Influence on the Thermally Induced Stresses in the Die and the Attachment”, Proc. of the 37th Elect. Comp. Conf., IEEE, Boston, Mass., May 1987.
  2. E. Suhir and W. E. Benedetto, “Mechanical Behavior of the “Euler” Test Probe”, Preprint ASME 87-WA/EEP-5, 1987 Winter Annual Meeting, Boston, Mass., Dec. 1987. 

1986

  1. E. Suhir, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies”,  Proc. of the Int. Symp. on Microelectronics, ISHM, 1986, Atlanta, Georgia, Oct. 1986.
  2. E. Suhir, “Stresses in Adhesively Bonded Bi-material Assemblies used in Electronic Packaging,” Proceedings of the Electronic Packaging Materials Science Symposium II, Palo Alto, California, April 15-18, pp.133-138, 1986.

1985

  1. E. Suhir, “Linear and Nonlinear Vibrations Caused by Periodic Impulses”, AIAA/ASME/ASCE/AHS 26th Structures, Structural Dynamics and Materials Conference, Orlando, Florida, April 1985.

Articles in Trade Magazines

  1. E.Suhir, “Design-for-Reliability and Accelerated-Testing of Solder Joint Interconnections in IC Packaging”, Chip Scale Review, 2019, in print
  2. E.Suhir, “Burn-in: When, For How Long and at What Level?” Chip Scale Review, 2019, in print
  3. E. Suhir, “Relieving Stress in Flip-Chip Solder Joints”, Chip Scale Reviews, v.21, No.5, September-October, 2017
  4. E.Suhir, “Avoiding Low-Cycle Fatigue in Solder Material Using Inhomogeneous Column-Grid-Array (CGA) Design”,  ChipScale Reviews, March-April 2016
  5. E. Suhir, “Electronics Reliability Cannot Be Assured, if it is not Quantified”, Chip Scale Reviews, March-April, 2014
  6. E.Suhir, “The Role of Failure-Oriented-Accelerated-Testing for Field Functional IC Packages”,  Circuits Assembly, July 01, 2013
  7. E. Suhir, L. Bechou, “Availability Index and Minimized Reliability Cost”, Circuit Assemblies, February 2013
  8. E. Suhir, L. Bechou, A.Bensoussan, “Technical Diagnostics in Electronics: Application of Bayes Formula and Boltzmann-Arrhenius-Zhurkov Model”, Circuit Assembly, December 3,  2012
  9. E. Suhir, “Electronic Product Qual Specs Should Consider Its Most Likely Application(s)”, Chip Scale Reviews, November 2012
  10. E.Suhir, “Predictive Modeling is a Powerful Means to Prevent Thermal Stress Failures in Electronics and Photonics”, Chip Scale Reviews, vol.15, No.4, July-August 2011
  11. E. Suhir, R. Mahajan, “Are Current Qualification Practices Adequate?“, Circuit Assembly, April 2011
  12. E. Suhir, “Probabilistic Design for Reliability”, Chip Scale Reviews, vol.14, No.6, 2010
  13. E. Suhir, “Reliability and Accelerated Life Testing”, Semiconductor International, February 1, 2005.
  14. E.Suhir, “Inventive Leadership: Could a Good Engineer Become a Good Entrepreneur?”, ASME Mechanical Engineering, November 2005
  15. E.Suhir, “Crossing the Lines, or Should We Just Mind Our Own Business?”, Feature Article, ASME Mechanical Engineering, 2004
  16. E.Suhir, “Analytical Stress-Strain Modeling in Photonics Engineering: Its Role, Attributes and Interaction with the Finite-Element Method”, Laser Focus World, May 2002.
  17. E. Suhir, “Thermo-Mechanical Stress Modeling in Microelectronics and Photonics”, Electronics Cooling, vol.7, No.4, 2001
  18. E. Suhir, “Thermal Stress Failures in Microelectronics and Photonics: Prediction and Prevention”, Future Circuits International, issue 5, 1999

EDUCATION

  • Ph.D., Dept. of Mechanics and Mathematics,  Moscow State University, Moscow, Russia
  • MS., Dept. of Naval Architecture, Polytechnic Institute,  Odessa, Ukraine

RESEARCH INTEREST

  • Applied Mathematics and Mechanics, Applied and Mathematical Physics

  • Materials Science and Engineering

  • Aerospace Electronics and Photonics

  • Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Assemblies, Packages and Systems

  • Applied Probability and Probabilistic DfR of Electronic and Photonic Devices and Systems

  • Analytical (Mathematical) Modeling in Applied Science and Engineering

  • Photonics, Fiber Optics, Mechanics of Optical Fibers 

  • Composite and “Smart” Materials and Systems

  • Thin Film Mechanics and Physics

  • Shock and Vibration Analyses and Testing

  • Dynamic Response of Materials and Structures to Shocks and Vibrations

  • Thermal Stress Analysis

  • Prediction and Prevention of Thermal Stress Failures in Electronic and Optical Engineering

  • Solder Materials and Solder Joint Interconnections in Electronic and Optical Engineering

  • Polymeric Materials in Electronics and Photonics

  • Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability

  • Nanotechnologies and Nanomaterials

  • Stretchable (Large Area) Electronics and Photonics: Physical Design for Reliability

  • Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations

  • Technical Diagnostics, Prognostics and Health Monitoring (PHM)

  • Vehicular (Aerospace, Automotive, Maritime) Electronics and Photonics: Design for Reliability

  • “Human-in-the-Loop”: Human-System Integration

HONORS AND AWARDS

  • 2019 IMAPS Lifetime Achievement Award “for making exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both”. Bestowed at the 52nd IMAPS Symp. on Microelectronics, Boston, Mass., Oct.1 , 2019.
  • 2019 IEEE EPS Electronic Packaging Field Award, “for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems.” Bestowed at the IEEE EPS conference, Las Vegas, NV, May 30, 2019
  • https://eps.ieee.org/awards/ieee-eps-technical-field-award.html
  • “With over 40 years of pioneering work in modeling and reliability engineering, Ephraim Suhir has enabled electronic packaging engineers to accurately predict stress in advanced packaged components for the design of more reliable devices. He was one of the earliest researchers to introduce the use of rigorous mechanics principles in electronic systems. His closed-form solutions have provided the electronics industry with invaluable tools for ensuring reliability and cost savings during the design process by eliminating errors early in the design process. He has applied his techniques to advanced components and packaged structures such as microelectronics, photonics, photo-voltaic, and thermo-electronic modules. Every serious mechanics practitioner and researcher in the electronics packaging field has been influenced by Suhir’s groundbreaking contributions”.
  • 2018 IMAPS 51-st Int. Symposium on Microelectronics “best of session” Award for the presentation “Elevated stand-off heights of solder joint interconnections of surface mounted IC packages result in an appreciable stress and warpage relief” (co-authored with S. Yi; J. Hwang; and R.Ghaffarian), Pasadena Convention Center, Oct. 8-11, 2018
  • 2017 IMAPS Daniel C. Hughes, Jr. Memorial Award, the highest, most prestigious annual honor, awarded to the individual who has the greatest combination of technical achievements related to microelectronics, combined with outstanding contributions supporting the microelectronics industry, academic achievement, or support and service to IMAPS.  Recipients of this award automatically become Life Members and Fellows of the Society. Bestowed at the IMAPS  award presentation ceremony at the 50th Int. Symp. on Microelectr., Raleigh, NC, October 10, 2017
  • 2017 IEEE EPS Exceptional Technical Achievement (ETA) Award “for the development of numerous probabilistic design concepts that enable effective and rapid assessment of the probability of failure of electronic products", bestowed at the IEEE ECTC, Lake Buena Vista, Florida (USA), June 1, 2017. 
  • 2016 ASME Electronic and Photonic Packaging Division (EPPD) Excellence-in-Mechanics Award “to recognize outstanding contributions to the applications of applied and engineering mechanics to the field of electronic packaging and for contributions to professional activities of electronic and photonic packaging division”, bestowed at the ASME 2016 Int. Mech. Eng. Congress and Exposition (IMECE), Phoenix, AZ, Nov.16, 2016
  • 2016 ASME Santa Clara Valley Section Technical Talk Speaker Award “in recognition of your exemplary service and dedication to the highest standards of excellence”; bestowed at the ASME Industry Honors Dinner, Santa Clara, May 05, 2016
  • 2015 AIAA Associate Fellowship Awardfor valuable contributions to the arts, sciences, and technology of aeronautics and astronautics”
  • 2015 ASME Santa Clara Valley Section Invited Speaker Award “for presenting ASME-SCVS Professional Development Seminars”; bestowed at the ASME Industry Honors Dinner, April 09,
  • 2014 IEEE CPMT Society Award “for delivering the short course at the 16-th Electronic Packaging Technology Conference”, December 3-5, Singapore
  • 2014 IEEE CPMT Society Award “in appreciation of sustained contribution to the ECTC, 25 Years”
  • 2014 ASME Santa Clara Valley Section Invited Speaker Award “for presenting ASME-SCVS Professional Development Seminars”; bestowed at the ASME Industry Honors Dinner, April 17
  • 2012 SPIE Fellowship Award “for outstanding and pioneering contributions to photonics engineering”
  • 2012 IMAPS Fellowship Award “for distinguished contributions to packaging of microelectronic devices”
  • 2012 ASME Santa Clara Valley Section Outstanding Achievement Award “for outstanding contribution to the engineering community”; bestowed at the ASME Industry Honors Dinner, April 19, 2012
  • 2009 IEEE CPMT Society Award “in appreciation of sustained contribution to the ECTC, 10 Years”
  • 2008 Fulbright Scholarship in Information Technologies, “as pertinent to the materials and structures in; reliability, physical design, packaging, and modeling of; and risk analyses and probabilistic assessments for, the evaluation of the behavior and performance of hardware and devices in information and communication technologies and systems”
  • 2004 ASME Worcester Reed Warner Medal for “outstanding contributions to the permanent literature of engineering through a series of papers in Mechanical, Microelectronic, and Optoelectronic Engineering, which established a new discipline known as the Structural Analysis of Microelectronic and Photonic Systems”
  • 2004 ASME Award “for valued services in advancing engineering education as Member-at-Large of the Professional Development Board”
  • 2002 Laser Focus World Award for the paper “Analytical Modeling Plays a Crucial Role in Photonics Engineering”, May 2002
  • 2002 APS Fellowship Award “for distinguished contributions to the field of analytical modeling of the physical behavior and reliability of microelectronic and photonic materials and systems”.
  • 2001 IMAPS John A. Wagnon Technical Achievement Award “for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry by advancing the art and science of predictive modeling in these areas, and laying the foundation of a discipline "Structural Analysis in Microelectronics and Photonics Systems” and for providing leadership in the application of Engineering and Applied Mechanics principles and methods to problems of physical design in microelectronics and photonics”.
  • 2001 ASME Award for valued services in advancing the engineering profession as keynote speaker on the topic “The Future of Microelectronics and Photonics, and the Role of Packaging”
  • 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award “for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society, and as a recognition of the pioneering work in Materials and Mechanical Engineering related to microelectronics and fiber-optics structures”
  • 2000 SPE International Engineering/Technology (Fred O. Conley) Award “for outstanding pioneering and continuing contributions to plastics engineering”
  • 1999 ASME (National) Charles Russ Richards Memorial Award “for outstanding contributions to mechanical engineering”
  • 1998 SPE Fellowship Award “for distinguished contributions to the scientific and engineering knowledge related to plastics”
  • 1998 IEEE CPMT Distinguished Lecturer Award “for teaching successful short courses and tutorials, and presenting invited and key-note talks in the field of Physical (Mechanical) Design and Reliability of Microelectronic and Photonic Systems”
  • 1997 ASME INTERPack’97 General Chair Awardfor organizing and conducting the  International Conference on Microelectronics and Photonics Packaging, Hawaii, June 15-19”
  • 1996 Bell Labs Distinguished Member of Technical Staff Award “for developing engineering mechanics methods to predict the performance and reliability of structures, and in manufacturing Lucent Technologies products”, Bell Laboratories
  • 1996 ASME Fellowship Award “for outstanding pioneering contributions to several important fields of Applied and Engineering Mechanics, and Materials Science and Engineering”,
  • 1994 IEEE Fellowship Award “for distinguished contributions to the field of the application of Engineering Mechanics and Materials Engineering to the analysis and physical design of microelectronic and fiber optic systems”,
  • 1994, 1995, 1996 ASME Awards “for valued services in advancing the engineering profession as Member of the Executive Committee and Chairman of the Honors and Awards Committee, ASME, Electrical and Electronic Packaging Division”.
  • 1994 ASME  Materials Division Award “for valued services in advancing the engineering profession and for presenting the highlight topic lecture  "The Future of Microelectronics and Fiber Optics and the Role of Materials and Mechanics''”, International Mechanical Engineering Congress and Exposition
  • 1993 AT&T Bell Laboratories Merit (Extraordinary Contribution) Award for “studies on modeling of stresses in, and optimization of manufacturing of, plastic electronic packages and optical fibers”,
  • 1992 ASME Clock Award “for distinguished contributions in the field of the application of Engineering Mechanics to Electronic Packaging, and for co-founding the Journal of Electronic Packaging”
  • 1990 Outstanding Paper Award “for a paper on mechanical design and reliability of ceramic electronic packages, Institute of Electrical and Electronic Engineers”
  • 1986 ISHM Best Paper Award “for a paper on thermal stresses in adhesively bonded and soldered assemblies, International Society for Hybrid Microelectronics”
  • 1986 AT&T Bell Laboratories Extraordinary Contribution Award “for studies on analytical stress modeling for advanced VLSI packages”

EDITORSHIP

Editor: ASME Journal of Electronic Packaging (1994-2002); Springer’s book series on physics, mechanics and reliability of materials in micro- and opto-electronics (2006-);  Silicon Valley Engineering Council (SVEC) Journal (2010)

Co-founder (1985) and Senior Associate Editor, ASME Journal of Electronic Packaging (1989-1994)

Contributing Editor: Chip Scale Reviews (2013-);

Distinguished Lecturer, IEEE Electronic Packaging Society (1995-)

Member, IEEE EDS Device Reliability Physics Committee (2019-); ASME AMD/MD Technical Committee on Constitutive Equations (2017-);IEEE TAB New Technology Directions Committee (1999-2007); ASME General Awards Committee (2007-2015);  IEEE CPMTS Fellowship Evaluation Committee (2001-) and Award Committee (2002-2017); IEEE VTS Fellowship Committee (2011-2015); ASME Boards on Professional Developments, and on Research and Technology (2000-2004); Advisory Committee, ASME Press, Monograph/Proceedings Series on "Materials, Molding, and Computation" (1992-2002); Society of Automotive Engineers (SAE), Committees on Fiber Optics and Avionic Engineering (2004-); Board of Governors, IEEE EPS (1996-2012); Team of experts serving AT&T, Lucent Technologies, and Bell Labs R&D communities in Applied Mechanics, Applied Physics, Mechanical Behavior of Materials, Manufacturing Engineering, Mechanical and Reliability Engineering, and Applied Probability (1990-2001)

Chairman, IEEE Group on Portable Information Devices; IEEE TAB New Technologies Direction Committee (2005-2007);IEEE VTS TC on Portable Devices (2007-2009); Honors and Awards Committee, ASME Electrical and Electronic Packaging Division and K-16 Committee (Heat Transfer in Microelectronics) of the Heat Transfer Division (1991-2000); New Technology Directions Committee, IEEE CPMT Society (1998-2002)

General Chair or Co-Chair: IEEE CPMT ASTR Conferences, San-Francisco, CA, September 2011;  College Park, MD, October 2008;IEEE Conference on Portable Information Devices, Portable’09, Anchorage, AK, September 2009;

IEEE/ASME/IMAPS Workshops on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, 1998, 1999, London, 2000; International Conference on Electronic and Photonic Packaging (Interpack-97), Hawaii, 1997; ASME Winter Annual Meetings, Division of Electrical and Electronic Packaging, Symposia on Structural Analysis in Electronic and Fiber-Optic Systems (1987-2001);IEEE Conference on Portable Devices and Polymeric Materials for Electronic and Photonic Applications, Garmisch-Partenkirchen, Germany, August 2008; IEEE Conference on Portable Information Devices, Portable’07, Orlando, Florida, March 2007; Accelerated Stress Testing and Reliability (ASTR) Workshop, ASTR’07, College Park, MD, October 2007; Track on Thermal Phenomena in Electronic Systems, IEEE  Vehicular Power and Propulsion Conference (VPPC), Dearborn, MI, USA, Sept. 2009; Chicago, IL, USA, Sept.  2011

Symposium Organizer/Co-Organizer, MRS Annual Meetings, Symposium on Mechanical Behavior of Microelectronic Materials and Structures (Boston,1990); Symposium on Reliability of Photonics Materials and Structures (San-Francisco, 1998); Symposium on Optical Interconnects (San Francisco, 2012); Symposium on Constitutive Modeling of the Mechanical Behavior and Performance of Electronic, Photonic, MEMS, and NEMS Materials, Assemblies, Packages, Modules, and Systems, 2018, Nov.9-15, Pittsburgh, PA,USA

Organizing/Scientific/Steering Committee Member, International Conference on Materials, Processing and Product Engineering, MPPE, Austria (2015-);IEEE Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices,  POLYTRONIK’ 2001, Potsdam, Germany;  2002, Budapest, Hungary; 2003, Monreaux, France; 2004, Portland, OR, USA; 2005, Wroclaw, Poland;THERMINIC,  European workshop on thermal phenomena in micro- and opto-electronic (1988-2014); IEEE Annual Electronic Components and Technology Conferences, Electronic Packaging, Interconnection, and Reliability Committees (1988-2016); International Conferences on Electronic Packaging (San Jose, CA, 1990, Binghamton, NY, 1992, Hawaii, 1995, 1999)

Session Organizer and Co-Chair, IEEE Aerospace Conference, Big Sky, Montana, 2012-2016

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